A3PE600-2FGG484I vs A3PE600-2FG484 Comparación

Comparación detallada lado a lado de A3PE600-2FGG484I por Microchip Technology y A3PE600-2FG484 por Microchip Technology. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.

Microchip Technology
A3PE600-2FGG484I A3PE600-2FGG484I - 600K-Gate ProASIC3E Flash FPGA | Microchip

A3PE600-2FGG484I - 600K-Gate ProASIC3E Flash FPGA | Microchip

A3PE600-2FGG484I ✓ Activo
Microchip Technology
A3PE600-2FG484 A3PE600-2FG484 - ProASIC3E 600K-Gate Flash FPGA | Microchip

A3PE600-2FG484 - ProASIC3E 600K-Gate Flash FPGA | Microchip

A3PE600-2FG484 ✓ Activo

Comparación de especificaciones

Parámetro A3PE600-2FGG484I A3PE600-2FG484
Marca Microchip Technology Microchip Technology
Categoría FPGA & CPLD FPGA & CPLD
Estado del ciclo de vida Activo Activo
Estado del stock In Stock In Stock
Precio unitario (USD) $0,00 $83,27
Family ProASIC3E Flash FPGA ProASIC3E (Flash-based FPGA)
System Gates 600000 600,000 gates
Logic Elements (CLBs) 13824 —
Number of Registers [DATA_NEEDED: number of registers] —
User I/Os (max, FG484) 270 —
Speed Grade -2 -2
Core Supply Voltage 1.5 V 1.5 V
I/O Supply Voltage [DATA_NEEDED: I/O supply voltage] —
Technology 130 nm Flash CMOS —
Max System Frequency 231 MHz —
Embedded Memory Embedded flash family; 110592 (bits, per distributor listing) —
Configuration Memory On-chip flash (single-chip, non-volatile) On-chip flash (non-volatile, single-chip)
Soft CPU Support Optional soft ARM support —
Encapsulado FBGA-484 (PBGA484, 23 x 23 mm, 1.0 mm pitch, 2.23 mm height) 484-ball FBGA (S-PBGA-B484)
Tipo de montaje Surface Mount —
Temperatura de funcionamiento -40C to +100C (Industrial) —
Terminal Form Ball —
Number of Terminals 484 —
Estado RoHS [DATA_NEEDED: RoHS status] —
Packaging Tray Tray
Logic Cells — 13,824
Number of I/Os — 270
Embedded RAM — 110592 bits
Maximum Operating Frequency — 310 MHz
Process Technology — 130 nm CMOS flash
Ball Pitch — 1.00 mm
Estilo de montaje — SMD/SMT
Operating Temperature (Commercial) — 0 C to +70 C
Reprogrammability — Yes (in-system reprogrammable)

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