A3PE600-FG256I vs A3PE600-2FG256I Comparación
Comparación detallada lado a lado de A3PE600-FG256I por Microchip Technology y A3PE600-2FG256I por Microchip Technology. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Microchip Technology
A3PE600-FG256I - 600K Gate Flash FPGA, 256-FBGA | Microchip
A3PE600-FG256I ✓ ActivoMicrochip Technology
A3PE600-2FG256I - ProASIC3E FPGA 600K Gates | Microchip
A3PE600-2FG256I ✓ ActivoComparación de especificaciones
| Parámetro | A3PE600-FG256I | A3PE600-2FG256I |
|---|---|---|
| Marca | Microchip Technology | Microchip Technology |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $44,60 | $26,40 |
| Logic Gates | 600000 | — |
| D Flip-Flops (DFFs) | 13824 | — |
| CLBs / VersaTiles | 13824 | — |
| Number of User I/O | 165 | — |
| Maximum System Frequency | 350 MHz | 310 MHz |
| Core Supply Voltage | 1.425 V to 1.575 V | — |
| Technology | 130 nm CMOS flash-based | — |
| Configuration Memory | Nonvolatile Flash (single-chip, live at power-up) | — |
| Temperatura de funcionamiento | -40C to +100C (TJ), industrial | -40C to +85C (industrial) |
| Encapsulado | 256-FBGA (LBGA), 17 x 17 mm, 1.0 mm pitch | 256-LBGA / FBGA (FG256) |
| Tipo de montaje | Surface Mount | Surface Mount |
| Packaging | Tray | — |
| Estado RoHS | RoHS Non-Compliant (contains lead; FGG variant is green) | RoHS Non-Compliant (contains lead, per distributor data) |
| Lead Free Status | Contains Lead | Contains Lead |
| Family | ProASIC3E | ProASIC3E (Flash FPGA) |
| Speed Grade | Standard (-1) | -2 |
| System Gates | — | 600000 gates |
| Logic Elements (VersaTiles) | — | [DATA_NEEDED: number of VersaTiles] |
| Number of I/O | — | 165 |
| Embedded Memory (RAM bits) | — | 110592 bits |
| Core Voltage | — | 1.5 V |
| Process Technology | — | 130 nm |
| Configuration Technology | — | Flash (non-volatile, single-chip) |
| Package Height | — | 1.80 mm |
| Total Cost of Ownership Feature | — | Low TOC, single-chip solution, reprogrammable |