A3PE600-FG484M vs A3P600L-FGG484I Comparación
Comparación detallada lado a lado de A3PE600-FG484M por Microchip Technology y A3P600L-FGG484I por Microchip Technology. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Microchip Technology
A3PE600-FG484M - 600K-Gate ProASIC3E Flash FPGA | Microchip
A3PE600-FG484M ✓ ActivoMicrochip Technology
A3P600L-FGG484I - 600K Gate ProASIC3L FPGA | Microchip
A3P600L-FGG484I ✓ ActivoComparación de especificaciones
| Parámetro | A3PE600-FG484M | A3P600L-FGG484I |
|---|---|---|
| Marca | Microchip Technology | Microchip Technology |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $68,90 | $41,35 |
| Family | ProASIC3E (Flash-Based FPGA) | — |
| System Gates | 600000 | — |
| Logic Elements / Cells | 13824 | — |
| CLBs | 13824 | — |
| Maximum User I/O | 270 | — |
| Embedded SRAM | 110592 bits (True Dual-Port) | — |
| Maximum System Frequency | 231 MHz | — |
| Technology | 130 nm, 7-layer metal (6 copper), flash-based CMOS | — |
| Core Voltage | 1.2 V to 1.5 V | — |
| Supply Voltage Range | 1.14 V to 1.575 V (nominal 1.5 V) | — |
| Configuration | Live-at-power-up flash fabric, single-chip (no external boot device) | Non-volatile flash, instant-on |
| Temperatura de funcionamiento | [DATA_NEEDED: operating temperature range] | — |
| Encapsulado | 484-ball FBGA (FG484), 23 x 23 mm, 1.0 mm ball pitch | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Packaging | Tray (M suffix) | — |
| Estado RoHS | [DATA_NEEDED: RoHS status] | Compliant (Green) |
| Distributor Stock Reference | 4480 pieces (Heisener listing) | — |
| Product Series | — | ProASIC3L |
| FPGA Family | — | Flash FPGA |
| Total System Gates | — | 600000 |
| Logic Elements | — | 13824 |
| User I/Os | — | 235 |
| Maximum System Performance | — | 350 MHz |
| Core Supply Voltage | — | 1.2 V to 1.5 V |
| Technology Node | — | 130 nm CMOS |
| Package Type | — | 484-ball FBGA (PBGA484) |
| Package Dimensions | — | 23 mm x 23 mm |
| Package Height | — | 2.23 mm |
| Ball Pitch | — | 1 mm |
| Rango de temperatura de funcionamiento | — | [DATA_NEEDED: industrial grade temperature range] |
| Low Power Mode | — | Flash*Freeze |