A3PE600-FGG256 vs A3PE600-1FG256I Comparación

Comparación detallada lado a lado de A3PE600-FGG256 por Microchip Technology y A3PE600-1FG256I por Microchip Technology. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.

Microchip Technology
A3PE600-FGG256 A3PE600-FGG256 - ProASIC3E Flash FPGA 600K Gates | Microchip

A3PE600-FGG256 - ProASIC3E Flash FPGA 600K Gates | Microchip

A3PE600-FGG256 ✓ Activo
Microchip Technology
A3PE600-1FG256I A3PE600-1FG256I - ProASIC3E FPGA 600K Gates 256-FBGA | Microchip

A3PE600-1FG256I - ProASIC3E FPGA 600K Gates 256-FBGA | Microchip

A3PE600-1FG256I ✓ Activo

Comparación de especificaciones

Parámetro A3PE600-FGG256 A3PE600-1FG256I
Marca Microchip Technology Microchip Technology
Categoría FPGA & CPLD FPGA & CPLD
Estado del ciclo de vida Activo Activo
Estado del stock In Stock In Stock
Precio unitario (USD) $19,60 $38,20
Family ProASIC3E ProASIC3E
System Gates 600000 gates —
Logic Elements (LEs) Approx. 7K LEs —
CLBs 13824 —
Embedded Memory 110592 bits [DATA_NEEDED: embedded memory bits]
Total User I/O 165 —
Technology Flash-based FPGA, CMOS —
Configuration Non-volatile flash, single-chip —
Encapsulado 256-FBGA (FGG256) 256-FBGA (256-LBGA)
Tipo de montaje Surface Mount Surface Mount
Maximum Toggle Frequency [DATA_NEEDED: maximum system performance/toggle frequency] —
Core Voltage [DATA_NEEDED: core supply voltage] —
I/O Voltage Support [DATA_NEEDED: supported I/O standards/voltages] —
Temperatura de funcionamiento [DATA_NEEDED: operating temperature range] —
Estado RoHS [DATA_NEEDED: RoHS compliance status] [DATA_NEEDED: RoHS status]
Security Features Flash lock, secure non-volatile configuration —
Design Software Microchip Libero SoC —
Logic Gates — 600000 gates
User I/O — 165
System Performance — 272 MHz
Process Technology — 130 nm flash
Core Supply Voltage — 1.5 V
Speed Grade — -1
Configuration Memory — On-chip flash, single chip, no external PROM
Temperature Grade — Industrial (-40C to +85C)
Terminal Form — Ball (BGA)
Package Shape — Square
Reprogrammability — Yes, live reprogrammable
Power-Up Behavior — Instant-on (flash based)

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