A3PE600-FGG256 vs A3PE600-1FGG256I Comparación

Comparación detallada lado a lado de A3PE600-FGG256 por Microchip Technology y A3PE600-1FGG256I por Microchip Technology. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.

Microchip Technology
A3PE600-FGG256 A3PE600-FGG256 - ProASIC3E Flash FPGA 600K Gates | Microchip

A3PE600-FGG256 - ProASIC3E Flash FPGA 600K Gates | Microchip

A3PE600-FGG256 ✓ Activo
Microchip Technology
A3PE600-1FGG256I A3PE600-1FGG256I - 600K-Gate Flash FPGA 165 I/O | Microchip

A3PE600-1FGG256I - 600K-Gate Flash FPGA 165 I/O | Microchip

A3PE600-1FGG256I ✓ Activo

Comparación de especificaciones

Parámetro A3PE600-FGG256 A3PE600-1FGG256I
Marca Microchip Technology Microchip Technology
Categoría FPGA & CPLD FPGA & CPLD
Estado del ciclo de vida Activo Activo
Estado del stock In Stock In Stock
Precio unitario (USD) $19,60 $33,50
Family ProASIC3E ProASIC3E
System Gates 600000 gates 600000
Logic Elements (LEs) Approx. 7K LEs —
CLBs 13824 —
Embedded Memory 110592 bits —
Total User I/O 165 —
Technology Flash-based FPGA, CMOS —
Configuration Non-volatile flash, single-chip —
Encapsulado 256-FBGA (FGG256) 256-LBGA (FBGA-256), 1.0 mm ball pitch
Tipo de montaje Surface Mount Surface Mount
Maximum Toggle Frequency [DATA_NEEDED: maximum system performance/toggle frequency] —
Core Voltage [DATA_NEEDED: core supply voltage] —
I/O Voltage Support [DATA_NEEDED: supported I/O standards/voltages] —
Temperatura de funcionamiento [DATA_NEEDED: operating temperature range] -40C to +100C (TJ), industrial
Estado RoHS [DATA_NEEDED: RoHS compliance status] [DATA_NEEDED: RoHS compliance status]
Security Features Flash lock, secure non-volatile configuration —
Design Software Microchip Libero SoC —
Logic Cells — 13824
Embedded SRAM — 110592 bits (up to 504 kbits family density)
User I/O — 165
Maximum System Performance — 272 MHz
Core Supply Voltage — 1.425 V to 1.575 V (1.5 V nominal)
Process Technology — 130-nm, 7-layer metal (6 copper), flash-based CMOS
Configuration Memory — On-chip Flash (Live at Power-Up, Level 0)
Logic Family — CMOS
Speed Grade — -1
Reprogrammability — Yes (single-chip, no external boot PROM)
Typical Application Domains — Industrial, communications, medical, aerospace/defense

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