A3PE600-FGG484 vs A3PE600-1FGG484 Comparación

Comparación detallada lado a lado de A3PE600-FGG484 por Microchip Technology y A3PE600-1FGG484 por Microchip Technology. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.

Microchip Technology
A3PE600-FGG484 A3PE600-FGG484 - ProASIC3E 600K-Gate Flash FPGA | Microchip

A3PE600-FGG484 - ProASIC3E 600K-Gate Flash FPGA | Microchip

A3PE600-FGG484 ✓ Activo
Microchip Technology
A3PE600-1FGG484 A3PE600-1FGG484 - 600K Gate Flash FPGA 484-FBGA | Microchip

A3PE600-1FGG484 - 600K Gate Flash FPGA 484-FBGA | Microchip

A3PE600-1FGG484 ✓ Activo

Comparación de especificaciones

Parámetro A3PE600-FGG484 A3PE600-1FGG484
Marca Microchip Technology Microchip Technology
Categoría FPGA & CPLD FPGA & CPLD
Estado del ciclo de vida Activo Activo
Estado del stock In Stock In Stock
Precio unitario (USD) $53,70 $44,90
Family ProASIC3E ProASIC3E
System Gates 600000 600000
Configurable Logic Blocks (CLBs) 13824 —
Logic Cells 13824 —
Embedded RAM 110592 bits —
User I/O 270 —
Maximum System Frequency 350 MHz —
Supply Voltage (Core) 1.425 V to 1.575 V —
Process Technology 130 nm CMOS flash 130 nm, 7-layer metal (6 copper), flash-based CMOS
Configuration Memory On-chip flash (non-volatile, live at power-up) On-chip flash, live at power-up (Level 0)
Encapsulado FBGA-484 (PBGA484) 484-FPBGA (FBGA-484), 23 x 23 mm, 1 mm pitch
Package Dimensions 23 x 23 mm, 2.23 mm height, 1 mm pitch —
Terminal Type Ball (BGA) —
Estilo de montaje Surface Mount —
Temperature Grading Commercial —
Estado RoHS Green / [DATA_NEEDED: RoHS compliance detail] ROHS3 Compliant
Number of Pins / Balls 484 —
Logic Cells / CLBs — 13824
User I/Os (this package) — 270
Max User I/Os (family) — 616
Embedded SRAM — 110592 bits (504 kbits true dual-port max per family data)
Core Supply Voltage — 1.425 V to 1.575 V (1.5 V nominal)
Speed Grade — -1
Temperatura de funcionamiento — 0 C to +85 C (TJ)
Tipo de montaje — Surface Mount
Packaging — Tray
Product Status — Active
Manufacturer Lead Time — 8 weeks
Reprogrammability — Yes, single-chip solution, no external boot device

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