A3PE600L-FG484M vs A3PE600-FGG484 Comparación
Comparación detallada lado a lado de A3PE600L-FG484M por Microchip Technology y A3PE600-FGG484 por Microchip Technology. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Microchip Technology
A3PE600L-FG484M - 600K-Gate Flash FPGA, 484-FBGA | Microchip
A3PE600L-FG484M ✓ ActivoMicrochip Technology
A3PE600-FGG484 - ProASIC3E 600K-Gate Flash FPGA | Microchip
A3PE600-FGG484 ✓ ActivoComparación de especificaciones
| Parámetro | A3PE600L-FG484M | A3PE600-FGG484 |
|---|---|---|
| Marca | Microchip Technology | Microchip Technology |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $44,90 | $53,70 |
| Family | ProASIC3EL (ProASIC3 Low Power) | ProASIC3E |
| System Gates | 600000 | 600000 |
| Logic Elements (LEs) | 110592 | — |
| User I/Os | 270 (device max 616) | — |
| Embedded Memory | Up to 504 kbits True Dual-Port SRAM (family) | — |
| Technology | 130-nm, 7-Layer Metal (6 Copper), Flash-Based CMOS Process | — |
| Core Voltage | 1.2 V to 1.5 V | — |
| Supply Voltage (I/O) | 1.5 V | — |
| Configuration | Flash-based, single-chip, Live-at-Power-Up Level 0 | — |
| Low Power Feature | Flash*Freeze Technology | — |
| Logic Family | CMOS | — |
| Encapsulado | 484-Ball FBGA (FG484), 1 mm pitch | FBGA-484 (PBGA484) |
| Pins / Balls | 484 | — |
| Temperatura de funcionamiento | 0 to 70 C | — |
| Tipo de montaje | Surface Mount | — |
| Reprogrammability | Yes (in-system, nonvolatile flash) | — |
| Security | ASIC-level flash security (on-chip bitstream storage) | — |
| Configurable Logic Blocks (CLBs) | — | 13824 |
| Logic Cells | — | 13824 |
| Embedded RAM | — | 110592 bits |
| User I/O | — | 270 |
| Maximum System Frequency | — | 350 MHz |
| Supply Voltage (Core) | — | 1.425 V to 1.575 V |
| Process Technology | — | 130 nm CMOS flash |
| Configuration Memory | — | On-chip flash (non-volatile, live at power-up) |
| Package Dimensions | — | 23 x 23 mm, 2.23 mm height, 1 mm pitch |
| Terminal Type | — | Ball (BGA) |
| Estilo de montaje | — | Surface Mount |
| Temperature Grading | — | Commercial |
| Estado RoHS | — | Green / [DATA_NEEDED: RoHS compliance detail] |
| Number of Pins / Balls | — | 484 |