A54SX16-1TQG176 vs A54SX16-2TQG176I Comparación
Comparación detallada lado a lado de A54SX16-1TQG176 por Microchip Technology y A54SX16-2TQG176I por Microchip Technology. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Microchip Technology
A54SX16-1TQG176 - SX FPGA 24K Gates 147 I/O TQFP-176 | Microchip
A54SX16-1TQG176 ✓ ActivoMicrochip Technology
A54SX16-2TQG176I - 16K Gate FPGA TQFP-176 | Microchip
A54SX16-2TQG176I ✓ ActivoComparación de especificaciones
| Parámetro | A54SX16-1TQG176 | A54SX16-2TQG176I |
|---|---|---|
| Marca | Microchip Technology | Microchip Technology |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $0,00 | $20,80 |
| Series | SX | SX Family (A54SX16) |
| Number of System Gates | 24000 | — |
| Number of I/O | 147 | — |
| Speed Grade | -1 | -2 |
| Supply Voltage (Core) | 3 V to 3.6 V | — |
| Supply Voltage (I/O) | 4.75 V to 5.25 V | — |
| Tensión de alimentación de funcionamiento | 3.3 V, 5 V | — |
| Temperatura de funcionamiento | 0C to +70C (TA) | -40C to +85C (industrial) |
| Encapsulado / Carcasa | 176-LQFP | — |
| Supplier Device Package | 176-TQFP (24x24 mm) | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Packaging | Tray | — |
| Programmability Type | Antifuse (one-time programmable) | — |
| Estado RoHS | ROHS3 Compliant | Compliant, lead free |
| Lead Free | Yes | — |
| Product Status | Active | — |
| Manufacturer Lead Time | 10 weeks | — |
| System Gates | — | 16000 gates |
| Logic Cells | — | 924 cells |
| CLBs | — | 1452 |
| Maximum Toggle Frequency | — | 320 MHz |
| User I/O | — | 147 |
| Process Technology | — | 0.35 um CMOS |
| Tensión de alimentación | — | 3V to 3.6V, 4.75V to 5.25V (3.3V/5V) |
| Programmability | — | Antifuse, one-time programmable |
| Encapsulado | — | TQFP-176 (TQG176), 24x24 mm |
| Package Height | — | 1.4 mm |
| Architecture | — | Sea-of-modules |
| Manufacturer Brand Origin | — | Microsemi / Microchip Technology |