A54SX16-TQG176I vs A54SX16-2TQG176 Comparación
Comparación detallada lado a lado de A54SX16-TQG176I por Microchip Technology y A54SX16-2TQG176 por Microchip Technology. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Microchip Technology
A54SX16-TQG176I - SX FPGA 24K Gates 176-TQFP | Microchip
A54SX16-TQG176I ✓ ActivoMicrochip Technology
A54SX16-2TQG176 - 16K-Gate Antifuse FPGA 176-TQFP | Microchip
A54SX16-2TQG176 ✓ ActivoComparación de especificaciones
| Parámetro | A54SX16-TQG176I | A54SX16-2TQG176 |
|---|---|---|
| Marca | Microchip Technology | Microchip Technology |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $0,00 | $339,14 |
| Series | SX | — |
| System Gates | 24000 | 16000 |
| Logic Cells / Modules | 924 | — |
| Number of I/O | 147 | — |
| Maximum System Frequency | 240 MHz | — |
| Process Technology | 0.35 um antifuse CMOS | 0.35 um |
| Supply Voltage (Core) | 3 V to 3.6 V | — |
| Supply Voltage (I/O) | 4.75 V to 5.25 V | — |
| Temperatura de funcionamiento | -40C to +85C (TA) | — |
| Encapsulado / Carcasa | 176-TQFP (24x24 mm) | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Programmability | One-time programmable (antifuse) | — |
| Packaging | Tray | — |
| Estado RoHS | ROHS3 Compliant | Compliant (G suffix, lead-free) |
| Lead Time | 10 weeks | — |
| Product Status | Active | — |
| Moisture Sensitivity Level | [DATA_NEEDED: MSL level] | [DATA_NEEDED: MSL level] |
| Speed Grade | [DATA_NEEDED: speed grade suffix] | -2 |
| Family | — | SX (Antifuse FPGA) |
| Logic Cells | — | 924 |
| User I/O | — | 147 |
| Maximum Frequency | — | 320 MHz |
| Tensión de alimentación | — | 3.3 V / 5 V |
| Programming Technology | — | Antifuse (one-time programmable) |
| Encapsulado | — | 176-Pin TQFP |
| Lead Finish | — | G (lead-free, matte tin) |
| Architecture | — | Sea-of-modules |
| Configuration Memory | — | Nonvolatile (no external configuration device required) |
| Rango de temperatura de funcionamiento | — | [DATA_NEEDED: operating temperature range] |