A54SX32-BG313M vs A54SX32-1BG329I Comparación

Comparación detallada lado a lado de A54SX32-BG313M por Microsemi y A54SX32-1BG329I por Microchip Technology. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.

Microsemi
A54SX32-BG313M A54SX32-BG313M - SX FPGA 249 I/O 313-BBGA | Microsemi

A54SX32-BG313M - SX FPGA 249 I/O 313-BBGA | Microsemi

A54SX32-BG313M ✗ Fin de vida
Microchip Technology
A54SX32-1BG329I A54SX32-1BG329I - 32K Gate SX FPGA, 249 I/O, 329-BGA | Microchip

A54SX32-1BG329I - 32K Gate SX FPGA, 249 I/O, 329-BGA | Microchip

A54SX32-1BG329I ✓ Activo

Comparación de especificaciones

Parámetro A54SX32-BG313M A54SX32-1BG329I
Marca Microsemi Microchip Technology
Categoría FPGA & CPLD FPGA & CPLD
Estado del ciclo de vida Fin de vida Activo
Estado del stock In Stock In Stock
Precio unitario (USD) $236,00 $628,26
Manufacturer Microsemi Corporation (now Microchip Technology) —
Product Series SX (Actel SX family FPGA) —
Logic Architecture Anti-fuse, sea-of-modules —
User I/O 249 249
Supply Voltage Rail 1 3 V to 3.6 V —
Supply Voltage Rail 2 4.75 V to 5.25 V —
Encapsulado / Carcasa 313-BBGA —
Supplier Device Package 313-PBGA (35x35 mm) —
Tipo de montaje Surface Mount Surface Mount
Programming Type One-Time Programmable (anti-fuse), non-volatile —
Configuration Memory None required (anti-fuse, instant-on) —
Temperature Grade M (military/extended grade, per M suffix) —
Categoría Embedded - FPGAs (Field Programmable Gate Array) —
Number of Logic Modules [DATA_NEEDED: number of logic modules] —
System Gates [DATA_NEEDED: system gate count] 32,000
Maximum Toggle Frequency [DATA_NEEDED: maximum toggle frequency] —
Rango de temperatura de funcionamiento [DATA_NEEDED: operating temperature range] —
Estado RoHS [DATA_NEEDED: RoHS status] [DATA_NEEDED: RoHS status]
Logic Modules (C-cells + R-cells) — 2880
Speed Grade — -1
Maximum System Performance — Up to 280 MHz
Configuration Technology — Antifuse (one-time programmable, non-volatile)
Encapsulado — 329-BBGA
Ball Pitch — 1.27 mm
Temperatura de funcionamiento — -40C to +85C (industrial)
Tensión de alimentación — [DATA_NEEDED: core supply voltage]
Architecture — Sea-of-modules (Actel SX family)
Configuration Storage — No external configuration PROM required
Nivel MSL — [DATA_NEEDED: moisture sensitivity level]
Manufacturer Family — Microchip (Actel/Microsemi) SX FPGA

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