ATSAMA5D21C-CU vs ATSAMA5D21B-CU Comparación
Comparación detallada lado a lado de ATSAMA5D21C-CU por Microchip Technology y ATSAMA5D21B-CU por Microchip Technology. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Microchip Technology
ATSAMA5D21C-CU - 500MHz Cortex-A5 MPU | Microchip 196-TFBGA
ATSAMA5D21C-CU ✓ ActivoMicrochip Technology
ATSAMA5D21B-CU - ARM Cortex-A5 500MHz MPU, 196-TFBGA | Microchip
ATSAMA5D21B-CU ✓ ActivoComparación de especificaciones
| Parámetro | ATSAMA5D21C-CU | ATSAMA5D21B-CU |
|---|---|---|
| Marca | Microchip Technology | Microchip Technology |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $9,85 | $9,80 |
| Manufacturer | Microchip Technology | Microchip Technology |
| Series | SAMA5D2 | SAMA5D2 |
| Core Processor | ARM Cortex-A5 | ARM Cortex-A5 |
| Number of Cores | 1 | — |
| Bit Width | 32-bit | — |
| Maximum CPU Clock | 500 MHz | 500 MHz |
| L1 Instruction Cache | 32 KB | — |
| L1 Data Cache | 32 KB | — |
| L2 Cache | 128 KB | — |
| Encapsulado | 196-TFBGA 11x11 mm, 0.8 mm pitch | 196-TFBGA (11x11 mm) |
| Integrated DRAM | Up to 1 Gbit DDR2 or 2 Gbit LPDDR2 SDRAM (SiP) | — |
| External Memory Bus | DDR2/DDR3L/LPDDR2/LPDDR3, QSPI, eMMC, SD/MMC | — |
| Ethernet | 10/100/1000 Mbps with IEEE 1588 PTP | — |
| USB | USB HS Host + Device, USB FS Host + Device | — |
| CAN | 2x CAN-FD | — |
| Other Connectivity | 2x SD/SDIO/MMC, I2C, SPI, UART, I2S | — |
| ADC | 12-bit ADC | — |
| Graphics | LCD controller (up to 1024x768) | — |
| Crypto Accelerators | AES, SHA, TRNG, secure boot, tamper detection | — |
| Audio | Class D amplifier, I2S, S/PDIF | — |
| Backup Mode Current | 5 uA | 5 uA (typical) |
| Rango de temperatura de funcionamiento | -40C to +85C (industrial) | — |
| Grade | Industrial (green, MRLC) | — |
| Tipo de montaje | Surface Mount (TFBGA) | Surface Mount |
| Nivel MSL | 3 | 3 |
| Estado RoHS | Compliant | Compliant |
| Core Count | — | 1 |
| Ancho del bus de datos | — | 32-bit |
| Ball Pitch | — | 0.8 mm |
| Temperatura de funcionamiento | — | -40C to +85C |
| External Memory Support | — | DDR2/DDR3L/LPDDR2/LPDDR3, QSPI, e.MMC |
| Co-processors | — | NEON MPE, FPU |
| Security Features | — | AES, SHA, TRNG, Secure Boot, Tamper Detection |