ATSAMA5D27C-CUR vs ATSAMA5D28A-CN Comparación
Comparación detallada lado a lado de ATSAMA5D27C-CUR por Microchip Technology y ATSAMA5D28A-CN por Microchip Technology. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Microchip Technology
ATSAMA5D27C-CUR - ARM Cortex-A5 MPU 500MHz | 289-LFBGA
ATSAMA5D27C-CUR ✓ ActivoMicrochip Technology
ATSAMA5D28A-CN - 500MHz Cortex-A5 MPU, 289-LFBGA | Microchip
ATSAMA5D28A-CN ✓ ActivoComparación de especificaciones
| Parámetro | ATSAMA5D27C-CUR | ATSAMA5D28A-CN |
|---|---|---|
| Marca | Microchip Technology | Microchip Technology |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $12,90 | $11,40 |
| Core Architecture | ARM Cortex-A5 (32-bit) with NEON and FPU | ARM Cortex-A5 (32-bit) with NEON and FPU |
| Maximum CPU Clock | 500 MHz | 500 MHz |
| Core Count | 1 | — |
| Cache (I-cache / D-cache) | 32 KB / 32 KB | — |
| Internal SRAM | 128 KB | 128 KB |
| ROM | 160 KB | — |
| External Memory Bus | 16-bit DDR2 / LPDDR / DDR3 / LPDDR3 | — |
| Encapsulado | 289-LFBGA (14 x 14 mm, 0.8 mm pitch) | 289-LFBGA (14x14 mm, 0.8 mm pitch) |
| Operating Voltage (Core) | 1.2 V | — |
| Rango de temperatura de funcionamiento | -40 °C to +85 °C (industrial) | — |
| Ethernet | 10/100 MAC with IEEE 1588 (EMAC) | Dual 10/100/1000 GMAC with 1588 PTP |
| USB | USB 2.0 HS Host + HS OTG + HS Device (3 ports) | USB 2.0 Host + Device |
| CAN | 2x CAN-FD controllers | Dual CAN-FD |
| Display Controller | TFT LCD up to 1024 x 768 | LCD up to WXGA (1280x720) |
| Touch Controller | Peripheral Touch Controller (PTC) | — |
| Audio Subsystem | Embedded (Class-D, I2S, SPDIF) | — |
| Cryptography | AES, SHA, TRNG, secure boot | — |
| Backup Mode Current | 5 µA typical (DDR in Self-Refresh) | 5 uA (RTC retention) |
| Tipo de montaje | Surface Mount (Tape & Reel) | Surface Mount (BGA) |
| Estado RoHS | Compliant | Compliant |
| Number of Cores | — | 1 |
| External Memory Support | — | DDR2 / DDR3L / LPDDR2 / LPDDR3 |
| Tensión de alimentación | — | 1.2 V (core) |
| Temperatura de funcionamiento | — | -40C to +85C (Industrial) |
| Image Sensor Interface | — | Hardware ISI |
| Storage Interfaces | — | QSPI, e.MMC, SD/MMC, NAND |