CA+ vs LM75ADP Comparación
Comparación detallada lado a lado de CA+ por Analog Devices y LM75ADP por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | CA+ | LM75ADP |
|---|---|---|
| Marca | Analog Devices | NXP Semiconductors |
| Categoría | Temperature Sensors | Temperature Sensors |
| Estado del ciclo de vida | Activo | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $2,05 | $0,66 |
| Manufacturer | Analog Devices / Maxim Integrated | — |
| Series | DS75 | — |
| MPN Suffix | CA+ (automotive / extended screening) | — |
| Tipo de sensor | Digital temperature sensor, local | Digital, Local (on-die bandgap) |
| Output Interface | I2C / SMBus (2-wire) | — |
| Resolución | 9 to 12 bits (factory default 11 bits) | — |
| Supply Voltage (VDD) | 2.7 V to 5.5 V | — |
| Supply Current (Active) | 0.5 mA (typ) | — |
| Rango de temperatura de funcionamiento | -55 °C to +125 °C | -55 °C to +125 °C |
| Accuracy (-25 °C to +100 °C) | ±2 °C (max) | — |
| Accuracy (-55 °C to +125 °C) | ±3 °C (max) | — |
| Address Pins | 3 (up to 8 devices per bus) | — |
| Alarm Output | O.S. pin (open-drain, programmable TOS / THYST) | — |
| Encapsulado | 8-pin SOIC (S) | 8-pin TSSOP (SOT505-1, 3.0 × 3.0 mm) |
| Tipo de montaje | Surface Mount | Surface Mount |
| Estado RoHS | [DATA_NEEDED: rohs status] | Compliant |
| Lead-Free | [DATA_NEEDED: lead-free] | — |
| AEC-Q100 Status | [DATA_NEEDED: AEC-Q100 grade] | — |
| Tipo de salida | — | I²C/SMBus, 11-bit signed |
| Temperature Accuracy | — | ±2 °C (max, -55 °C to +125 °C) |
| Temperature Resolution | — | 0.125 °C (11-bit, 3-bit fraction) |
| Supply Voltage (VCC) | — | 2.8 V to 5.5 V |
| Supply Current (active) | — | 1 mA (typ, conversions active) |
| Supply Current (shutdown) | — | 10 µA (max) |
| OVERTEMP Output | — | Open-drain, programmable trip + hysteresis |
| I²C Address Pins | — | 3 (A0/A1/A2), supports up to 8 devices per bus |
| I²C Clock Rate | — | Up to 400 kHz (Fast Mode) |
| Nivel MSL | — | 1 (per JEDEC J-STD-020) |
| Conversion Technique | — | Sigma-Delta A-to-D conversion with on-chip bandgap |
| Legacy Compatibility | — | Pin-for-pin replacement for industry-standard LM75 |