DSP56321VF275 vs DSP56311VF150 Comparación
Comparación detallada lado a lado de DSP56321VF275 por NXP Semiconductors y DSP56311VF150 por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
DSP56321VF275 - 275MHz 24-Bit Fixed-Point DSP | NXP | 196-MAPBGA
DSP56321VF275 NrndComparación de especificaciones
| Parámetro | DSP56321VF275 | DSP56311VF150 |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | DSP | DSP |
| Estado del ciclo de vida | NRND | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $17,60 | $24,90 |
| Product Type | Fixed-Point Digital Signal Processor | — |
| Series | DSP56300 family | DSP56300 (Symphony) |
| Core Clock Speed | 275 MHz | — |
| Instruction Throughput | 275 MIPS / 550 MMACS | 150 MIPS |
| Data Word Width | 24-bit | — |
| On-Chip RAM | 576 KB | 384 KB |
| On-Chip ROM | 576 bytes | — |
| External Address Bus Width | 24-bit | — |
| DMA Channels | 6 | 6 |
| Communication Interfaces | Host Interface, SSI, SCI | — |
| Coprocessor | EFCOP (Enhanced Filter Coprocessor) | — |
| I/O Voltage | 3.3 V | 3.30 V |
| Core Voltage | 1.0-1.2 V (internal regulator) | — |
| Encapsulado | 196-MAPBGA (15x15 mm) | 196-ball MAP-BGA (15x15 mm) |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount |
| Packaging | Tray | — |
| Estado RoHS | Compliant (lead-free) | [DATA_NEEDED: RoHS status] |
| Manufacturer | — | NXP Semiconductors (formerly Freescale) |
| Type | — | Fixed-Point Digital Signal Processor |
| Core Clock Frequency | — | 150 MHz |
| Multiply-Accumulate Performance | — | 300 MMACS |
| Ancho del bus de datos | — | 24 bit |
| Bootstrap ROM | — | 576 B |
| Enhanced Filter Coprocessor (EFCOP) | — | Yes, parallel execution |
| Serial Interfaces | — | Host Interface (HI), SSI, SCI |
| Input Logic Compatibility | — | TTL-compatible |
| Temperatura de funcionamiento | — | [DATA_NEEDED: operating temperature range] |
| Process Technology | — | High-density CMOS |
| Nivel MSL | — | [DATA_NEEDED: MSL rating] |