EP1AGX35CF780I6N vs EP1AGX20CF780C6N Comparación
Comparación detallada lado a lado de EP1AGX35CF780I6N por Intel y EP1AGX20CF780C6N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP1AGX35CF780I6N | EP1AGX20CF780C6N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Última compra | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $278,75 | $38,95 |
| Manufacturer | Intel (formerly Altera) | — |
| Family | Arria GX | Arria GX |
| Device Series | EP1AGX35 | — |
| Logic Elements (LE) | 33,250 | — |
| Logic Array Blocks (LABs) | 33,520 | 1,079 |
| Process Technology | 90 nm | 90 nm |
| Core Voltage | 1.2 V | 1.2 V |
| Embedded Transceivers | Up to 3.125 Gbps | — |
| Transceiver Count | [DATA_NEEDED: transceiver count for EP1AGX35 in F780 package] | — |
| Encapsulado | 780-pin Flip-Chip BGA (FC-FBGA) | — |
| Package Code | BGA-780 | — |
| Package Dimensions | 29 x 29 mm | — |
| Terminal Pitch | 1.00 mm | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Terminal Form | Ball | — |
| Terminal Shape | [DATA_NEEDED: terminal shape - confirmed SQUARE package per partstack] | — |
| Temperature Grade | Industrial | Commercial (0 C to +85 C) |
| Rango de temperatura de funcionamiento | -40C to +100C (Industrial, I6 speed grade) | — |
| Speed Grade | I6 | C6 (commercial) |
| Estado RoHS | [DATA_NEEDED: RoHS status not stated in verified sources] | — |
| Logic Elements | — | 21,580 |
| Embedded Memory (bits) | — | 1,229,184 |
| User I/O Pins | — | 341 |
| Number of Transceivers | — | 4 (integrated multi-gigabit) |
| Max Transceiver Data Rate | — | 3.125 Gbps |
| Package Type | — | FBGA-780 (29 x 29 mm, 1.0 mm pitch) |
| Lead-Free / RoHS | — | Lead free |
| Configuration Modes | — | PS, FPP, AS, JTAG |