EP1AGX50CF484C3 vs EP1AGX50CF484C5N Comparación
Comparación detallada lado a lado de EP1AGX50CF484C3 por Intel y EP1AGX50CF484C5N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP1AGX50CF484C3 | EP1AGX50CF484C5N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $218,00 | $108,40 |
| Family | Arria GX | Arria GX |
| Logic Elements | 50,160 | 50,000 |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| Total RAM Bits | 2,475,072 bits | — |
| M4K Memory Blocks | 4,506 | — |
| M-RAM Blocks | 252 | — |
| Embedded Multipliers (18x18) | [DATA_NEEDED: multiplier count] | — |
| Transceiver Channels | 12 (up to 3.125 Gbps) | — |
| User I/O Pins | 232 | — |
| Encapsulado | 484-ball FBGA (FineLine BGA) | 484-pin FBGA |
| Speed Grade | C3 (commercial, fastest) | C5N |
| Temperatura de funcionamiento | 0C to +85C (commercial) | -40C to +125C |
| Core Voltage | 1.2 V | 1.2 V |
| Configuration Method | Passive serial, Fast passive parallel, JTAG | — |
| Estado RoHS | Compliant | Lead free / RoHS Compliant |
| Process Technology | 90 nm | 90 nm |
| Embedded Memory | — | 4.5 Mbits (approx) |
| Transceiver Data Rate | — | Up to 3.125 Gbps |
| Number of Transceivers | — | [DATA_NEEDED: number of transceiver channels] |
| User I/O Banks | — | [DATA_NEEDED: number of user I/O banks] |
| Maximum User I/O | — | [DATA_NEEDED: maximum user I/O count] |
| Memory Controller Support | — | DDR / DDR2 / QDRII |
| Tipo de montaje | — | Surface Mount (BGA) |
| Nivel MSL | — | [DATA_NEEDED: MSL level] |
| Condition | — | New Original Stock |