EP1C12F324C6AA vs EP1C12F324C6N Comparación
Comparación detallada lado a lado de EP1C12F324C6AA por Intel y EP1C12F324C6N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP1C12F324C6AA | EP1C12F324C6N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $36,90 | $22,10 |
| Series | Cyclone | Cyclone® |
| Family | Cyclone I | — |
| Logic Elements | 12,060 | — |
| Total RAM Bits | 239,616 | 239,616 |
| Number of I/O | 249 | — |
| Number of Logic Cells | 12,060 | — |
| Number of Gates | [DATA_NEEDED: number of gates] | — |
| Number of Multipliers | 52 (18x18) | — |
| Number of PLLs | 4 | — |
| Maximum Operating Frequency | 405.2 MHz | — |
| Process Technology | 130 nm CMOS | 130 nm SRAM |
| Core Supply Voltage | 1.5 V | — |
| Temperatura de funcionamiento | 0 C to +85 C | 0°C to 85°C (commercial; C6N suffix) |
| Encapsulado | 324-BGA (FineLine BGA) | 324-ball FineLine BGA |
| Tipo de montaje | Surface Mount | Surface Mount (BGA) |
| Estado RoHS | [DATA_NEEDED: rohs status] | Compliant (lead-free) |
| Nivel MSL | [DATA_NEEDED: MSL level] | — |
| Logic Elements (LE) | — | 12,060 |
| Logic Array Blocks (LAB) | — | 1,206 |
| Embedded Multipliers (9-bit) | — | 52 |
| Phase-Locked Loops (PLL) | — | 2 |
| Maximum User I/Os | — | 249 |
| Core Voltage (VCCINT) | — | 1.5 V |
| Speed Grade | — | 6 |
| Configuration Method | — | SRAM, serial/parallel via EPCS flash or JTAG |
| I/O Standards Supported | — | LVTTL, LVCMOS, LVDS, PCI, SSTL |