EP1K100FC256-3 vs EP1K100FI256-2 Comparación
Comparación detallada lado a lado de EP1K100FC256-3 por Intel y EP1K100FI256-2 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP1K100FC256-3 | EP1K100FI256-2 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $30,22 | $92,00 |
| Family | ACEX-1K | ACEX 1K |
| Logic Elements | 4,992 | — |
| Typical Gates | 100,000 | — |
| Embedded Memory (EAB RAM) | 49,152 bits | — |
| Number of LABs/CLBs | 624 | 624 |
| User I/O Count | 186 | — |
| Core Voltage (VCCINT) | 2.5 V | — |
| I/O Voltage (VCCIO) | [DATA_NEEDED: VCCIO voltage range] | — |
| Process Technology | 0.22 µm CMOS | 0.22 µm CMOS |
| Speed Grade | -3 | -2 (mid-range) |
| Encapsulado | 256-ball FineLine BGA (FBGA-256) | — |
| Package Outline | [DATA_NEEDED: package dimensions mm] | — |
| Temperatura de funcionamiento | Commercial (0°C to +70°C) | -40 °C to +85 °C (Industrial) |
| Tipo de montaje | Surface Mount | Surface Mount |
| Nivel MSL | [DATA_NEEDED: MSL rating] | — |
| Estado RoHS | [DATA_NEEDED: RoHS compliance status] | [DATA_NEEDED: RoHS status] |
| Lead-Free | [DATA_NEEDED: lead-free status] | — |
| JTAG / Boundary Scan | IEEE 1149.1 compliant | — |
| Series | — | EP1K100 |
| Logic Elements / Cells | — | 4,992 |
| System Gates | — | 100,000 |
| Total RAM Bits | — | 49,152 |
| Number of I/O | — | 186 |
| Number of Gates | — | 257,000 |
| Voltage - Supply | — | 2.5 V |
| Encapsulado / Carcasa | — | 256-BGA (FineLine BGA, FBGA-256) |
| Max Frequency | — | 250 MHz |