EP1K100FI256-3 vs EP1K100FC256-3N Comparación
Comparación detallada lado a lado de EP1K100FI256-3 por Intel y EP1K100FC256-3N por Altera. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Intel
EP1K100FI256-3 - 100K-Gate ACEX 1K FPGA, 186 I/O, FBGA-256 | Intel
EP1K100FI256-3 ⚠ Última compraComparación de especificaciones
| Parámetro | EP1K100FI256-3 | EP1K100FC256-3N |
|---|---|---|
| Marca | Intel | Altera |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Última compra | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $52,90 | $0,00 |
| Family | ACEX 1K | — |
| Device Logic Elements | 4,992 | — |
| Typical Gate Count | 100,000 gates | 100000 |
| Maximum RAM Bits | 49,152 bits | — |
| User I/O Pins | 186 | — |
| Dedicated Inputs | 6 | — |
| Speed Grade | -3 | -3 (commercial) |
| Nominal Core Voltage | 2.5 V | — |
| Core Voltage Range | 2.375 V to 2.625 V | — |
| Process Technology | 0.22 micron CMOS | 0.22 um |
| Rango de temperatura de funcionamiento | -40 C to +85 C (Industrial) | — |
| Encapsulado | 256-ball FineLine BGA (FBGA-256) | 256-BGA (FBGA) |
| Tipo de montaje | Surface Mount | Surface Mount |
| Configuration Method | SRAM-based, JTAG / PS / AS supported | — |
| Estado RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: N suffix suggests lead-free but no certificate found] |
| Lead-Free | [DATA_NEEDED: lead-free status] | — |
| AEC-Q100 Qualification | Not qualified | — |
| Nivel MSL | [DATA_NEEDED: MSL level] | — |
| JTAG Boundary Scan | Yes (IEEE 1149.1) | — |
| Product Family | — | ACEX 1K |
| Programmable Logic Type | — | FPGA (Field Programmable Gate Array) |
| Number of Logic Elements/Cells | — | 4992 |
| Number of LABs | — | 624 |
| Total RAM Bits | — | 49152 |
| Number of User I/Os | — | 186 |
| Core Supply Voltage (VCCINT) | — | 2.5 V |
| Number of Pins/Terminals | — | 256 |
| Terminal Form | — | BALL |
| Package Code | — | BGA |
| Maximum Internal Frequency | — | [DATA_NEEDED: maximum internal frequency; conflicts in listings: 200 MHz vs 250 MHz, use timing report] |
| Operating Temperature Grade | — | Commercial (per Partstack listing) |
| Number of EABs | — | [DATA_NEEDED: number of embedded array blocks] |