EP1K30FC256-1 vs EP1K30FC256-2 Comparación
Comparación detallada lado a lado de EP1K30FC256-1 por Intel y EP1K30FC256-2 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP1K30FC256-1 | EP1K30FC256-2 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $17,85 | $22,95 |
| Family | ACEX-1K | ACEX-1K |
| Logic Elements | 17,280 | 1,728 |
| Typical Gates | 30,000 | 30,000 |
| Logic Cells | 1,728 | — |
| Embedded RAM Bits | 24,576 | — |
| User I/O Pins | 171 | 171 |
| Logic Array Blocks (LABs) | 216 | — |
| Embedded Array Blocks (EABs) | 6 | — |
| Core Voltage (VCCINT) | 2.5 V | — |
| I/O Voltage (VCCIO) | 3.3 V / 2.5 V (multi-voltage) | — |
| Operating Temperature Grade | Commercial (0C to +70C) | Commercial |
| Speed Grade | -1 (standard, slowest in family) | -2 |
| Maximum Internal Frequency | 250 MHz (per family datasheet) | — |
| Process Technology | 2.5 V CMOS | 0.22 µm CMOS |
| Encapsulado | 256-pin FineLine BGA (FBGA) | 256-ball FineLine BGA (FBGA) |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount (BGA) |
| Configuration Interface | Passive Serial / Passive Parallel / JTAG | — |
| Programming Method | SRAM-based, in-system programmable | — |
| Estado RoHS | Compliant | [DATA_NEEDED: RoHS compliance status] |
| Configurable Logic Blocks (CLBs) | — | 216 |
| On-chip RAM Bits | — | 24,576 |
| Core Voltage | — | 2.5 V |
| Recuento de pines | — | 256 |
| Configuration Method | — | SRAM (volatile, serial PROM or JTAG) |
| JTAG Support | — | Yes (IEEE 1149.1 boundary scan) |
| Tipo de memoria | — | Dual-port EAB blocks |
| Maximum Frequency | — | 200 MHz |