EP1K30FC256-3NAA vs EP1K30FC256-1 Comparación
Comparación detallada lado a lado de EP1K30FC256-3NAA por Intel y EP1K30FC256-1 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP1K30FC256-3NAA | EP1K30FC256-1 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Obsolete | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $11,50 | $17,85 |
| Product Category | FPGA - Field Programmable Gate Array | — |
| Family | ACEX-1K | ACEX-1K |
| Number of Logic Elements | 1728 | — |
| Number of Gates | 30000 (30K) | — |
| Embedded RAM Bits | 24576 bits | 24,576 |
| Number of User I/Os | 171 | — |
| Maximum Internal Clock Frequency | 200 MHz | — |
| Core Supply Voltage | 2.5 V | — |
| IC Process Technology | 0.22 um | — |
| Package Type | 256-ball FBGA (FineLine BGA) | — |
| Package Form | 256-BBGA | — |
| Tipo de montaje | Surface Mount | Surface Mount (BGA) |
| Speed Grade | -3 (ordering code) | -1 (standard, slowest in family) |
| Configuration Type | SRAM-based, external configuration device required | — |
| Rango de temperatura de funcionamiento | [DATA_NEEDED: operating temperature range] | — |
| I/O Supply Voltage | [DATA_NEEDED: VCCIO voltage options] | — |
| Power Dissipation | [DATA_NEEDED: typical power dissipation, design dependent] | — |
| Lead-Free / RoHS | [DATA_NEEDED: manufacturer PCN confirms RoHS status] | — |
| Logic Elements | — | 17,280 |
| Typical Gates | — | 30,000 |
| Logic Cells | — | 1,728 |
| User I/O Pins | — | 171 |
| Logic Array Blocks (LABs) | — | 216 |
| Embedded Array Blocks (EABs) | — | 6 |
| Core Voltage (VCCINT) | — | 2.5 V |
| I/O Voltage (VCCIO) | — | 3.3 V / 2.5 V (multi-voltage) |
| Operating Temperature Grade | — | Commercial (0C to +70C) |
| Maximum Internal Frequency | — | 250 MHz (per family datasheet) |
| Process Technology | — | 2.5 V CMOS |
| Encapsulado | — | 256-pin FineLine BGA (FBGA) |
| Configuration Interface | — | Passive Serial / Passive Parallel / JTAG |
| Programming Method | — | SRAM-based, in-system programmable |
| Estado RoHS | — | Compliant |