EP1K30FI256-2 vs EP1K30F256-3 Comparación
Comparación detallada lado a lado de EP1K30FI256-2 por Intel y EP1K30F256-3 por Altera. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP1K30FI256-2 | EP1K30F256-3 |
|---|---|---|
| Marca | Intel | Altera |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Obsolete | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $18,20 | $15,60 |
| Family | ACEX-1K | ACEX 1K |
| Logic Elements (LEs) | 1728 | — |
| Typical Gate Count | 30,000 gates | — |
| Embedded RAM Bits | 24,576 bits | — |
| Logic Array Blocks (LABs) | 216 | — |
| User I/O Pins | 171 | — |
| Maximum Internal Frequency | 200 MHz | — |
| Process Technology | 0.22 µm CMOS | 0.18 µm CMOS SRAM |
| Core Supply Voltage (VCCINT) | 2.375 V to 2.625 V (2.5 V typical) | — |
| Encapsulado | 256-ball FBGA | FBGA-256 (FineLine BGA) |
| Tipo de montaje | Surface Mount | Surface Mount (BGA) |
| Temperatura de funcionamiento | -40 °C to +85 °C (Industrial) | [DATA_NEEDED: operating temperature range] |
| Speed Grade | -2 | -3 |
| Configuration Interface | JTAG / Serial / ByteBlaster | — |
| Estado RoHS | [DATA_NEEDED: RoHS status not in verified web data] | [DATA_NEEDED: RoHS compliance status] |
| Logic Elements | — | 1,728 |
| Equivalent Gates | — | 30,000 |
| Configurable Logic Blocks (CLBs) | — | 216 |
| Embedded Memory (RAM bits) | — | 24,576 |
| Maximum User I/O Pins | — | 171 |
| Frecuencia de reloj máxima | — | 909 MHz |
| Core Voltage | — | 1.8 V |
| Configuration Method | — | SRAM (requires external configuration device) |
| JTAG Support | — | Yes (IEEE 1149.1 / IEEE 1532) |
| PLL | — | Yes (on-chip) |