EP1K50FI256-2AA vs EP1K50FC256-3 Comparación
Comparación detallada lado a lado de EP1K50FI256-2AA por Intel y EP1K50FC256-3 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP1K50FI256-2AA | EP1K50FC256-3 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Obsolete | Última compra |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $15,40 | $54,40 |
| Product Family | ACEX 1K | — |
| Part Status | Obsolete | — |
| Number of LABs/CLBs | 360 | — |
| Number of Logic Elements/Cells | 2880 | — |
| Total RAM Bits | 40960 | — |
| Number of I/O | 186 | — |
| Number of Gates | 199000 | — |
| Tensión de alimentación | 2.375V ~ 2.625V | — |
| Core Voltage Nominal | 2.5V | — |
| Temperatura de funcionamiento | -40C ~ 85C (TA) | Commercial (0C to +70C) [DATA_NEEDED: exact operating temp grade] |
| Encapsulado / Carcasa | 256-BBGA | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Process Technology | 0.22um CMOS | 0.22 um CMOS |
| Maximum Internal Frequency | 200 MHz | — |
| Speed Grade | -2 | -3 |
| Estado RoHS | [DATA_NEEDED: RoHS status] | — |
| Nivel MSL | [DATA_NEEDED: MSL level] | — |
| Series | — | ACEX-1K |
| Family | — | ACEX 1K |
| Logic Elements (LEs) | — | 2,880 |
| Typical Gates | — | 50,000 |
| Embedded RAM Bits | — | 40,960 |
| Logic Array Blocks (LABs) | — | 360 |
| Embedded Array Blocks (EABs) | — | 12 |
| Maximum User I/O | — | 186 |
| Core Voltage | — | 2.5 V |
| Maximum Frequency | — | 166.67 MHz |
| Encapsulado | — | 256-pin FineLine BGA (FBGA-256) |
| Package Dimensions | — | 17 x 17 mm |
| Programming Interface | — | JTAG (IEEE 1149.1), ByteBlaster |