EP1K50QC208-2N vs EP1K30QC208-2N Comparación
Comparación detallada lado a lado de EP1K50QC208-2N por Intel y EP1K30QC208-2N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP1K50QC208-2N | EP1K30QC208-2N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Obsolete | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $27,80 | $22,10 |
| Series | ACEX-1K | ACEX 1K |
| Family | ACEX 1K | ACEX 1K |
| Logic Elements | 2,880 | — |
| Typical Gates | 50,000 | 30,000 |
| Logic Array Blocks (LABs) | 360 | — |
| Embedded Memory (EAB SRAM) | 40 kbit | — |
| User I/Os | 147 | — |
| Number of I/O Banks | [DATA_NEEDED: number of I/O banks] | — |
| Maximum Toggle Frequency | 200 MHz | — |
| Pin-to-Pin Delay (LE) | 0.4 ns (per data sheet snippet) | — |
| Process Technology | 0.22 µm CMOS | — |
| Core Supply Voltage | 2.5 V | — |
| I/O Supply Voltage | [DATA_NEEDED: I/O supply voltage] | — |
| Configuration Interface | JTAG (IEEE 1149.1), Serial (PS/AS) | — |
| Encapsulado | 208-pin PQFP (BFQFP) | — |
| Tipo de montaje | Surface Mount (Gull-Wing) | Surface Mount |
| Temperatura de funcionamiento | 0 °C to 85 °C (Commercial) | 0°C to +70°C (commercial) |
| Nivel MSL | [DATA_NEEDED: MSL level] | — |
| Estado RoHS | [DATA_NEEDED: RoHS status] | unknown (legacy part, pre-RoHS-era design) |
| Logic Elements / Cells | — | 1,728 |
| Total RAM Bits | — | 24,576 (24 Kbit embedded memory) |
| Number of LABs/CLBs | — | 216 |
| Number of I/O | — | 147 |
| Number of Gates | — | 30,000 |
| Core Supply Voltage (VCCINT) | — | 2.5 V |
| Technology Node | — | 0.22 µm CMOS |
| Operating Frequency (max) | — | 200 MHz |
| Encapsulado / Carcasa | — | 208-BFQFP (PQFP) |
| Configuration Method | — | SRAM (volatile) - serial/parallel/JTAG |