EP1M350F780C7 vs EP1M350F780C7ES Comparación
Comparación detallada lado a lado de EP1M350F780C7 por Intel y EP1M350F780C7ES por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP1M350F780C7 | EP1M350F780C7ES |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $162,00 | $0,00 |
| Family | Mercury (PLD) | — |
| Device Logic Elements | [DATA_NEEDED: exact LE count] | — |
| Logic Array Blocks (LABs) | 1440 | — |
| System Gates | 350,000 | — |
| Maximum User I/Os | 486 | — |
| Encapsulado | 780-ball FineLine BGA (F780) | — |
| Package Type | FINE LINE BGA-780 | FINE LINE BGA-780 |
| Supply Voltage (Core) | 1.8 V | — |
| Logic Family | CMOS | CMOS |
| Temperatura de funcionamiento | 0 C to 85 C (Commercial) | 0 C to 85 C |
| Tipo de montaje | Surface Mount | Surface Mount |
| Transceivers / CDR Support | Up to 1.25 Gbps with CDR | — |
| Configuration Method | JTAG / Quartus II | — |
| Estado RoHS | [DATA_NEEDED: rohs status] | unknown |
| Nivel MSL | [DATA_NEEDED: MSL rating] | — |
| Process Technology | CMOS SRAM-based | — |
| Product Type | — | Field Programmable Gate Array (FPGA) |
| User I/O Count | — | 486 pins |
| Total Package Pins | — | 780 pins |
| Package Category | — | 780-BBGA |
| Tensión de alimentación | — | 1.8 V |
| Maximum Stated Transceiver Data Rate | — | 1.25 Gbps |
| Channels Supported at 1.25 Gbps | — | 8 channels |
| Remaining Channel Limit | — | 10 channels at 1.0 Gbps or less |
| Clock Data Recovery | — | Supported |
| High-Speed Transceivers | — | Integrated |
| REACH Status | — | unknown |
| Logic Element Count | — | [DATA_NEEDED: logic element count] |
| Embedded Memory Capacity | — | [DATA_NEEDED: embedded memory capacity] |
| Transceiver Count | — | [DATA_NEEDED: transceiver count] |
| Package Dimensions | — | [DATA_NEEDED: package dimensions] |
| Resistencia térmica | — | [DATA_NEEDED: junction-to-ambient thermal resistance] |