EP1S25F672C8N vs EP1S25F672C6N Comparación
Comparación detallada lado a lado de EP1S25F672C8N por Intel y EP1S25F672C6N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP1S25F672C8N | EP1S25F672C6N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Obsolete | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $179,40 | $192,75 |
| Family | Stratix (EP1S) | Stratix |
| Logic Elements (LE) | 25,660 | — |
| Process Technology | 130 nm CMOS | CMOS |
| Core Supply Voltage | 1.5 V | — |
| Embedded Memory | 1,944 Kbit (TriMatrix) | — |
| DSP Blocks | 12 (9-bit x 9-bit multipliers) | — |
| PLLs | 6 | — |
| Maximum User I/O | 426 | 473 |
| Temperatura de funcionamiento | 0 °C to 85 °C (commercial) | 0 C to +85 C (Commercial) |
| Speed Grade | C8 (-8) | — |
| Package Type | 672-ball FineLine BGA (FBGA) | — |
| Package Dimensions | 35 x 35 mm, 1.27 mm pitch | — |
| Logic Family | CMOS | — |
| Maximum Internal Frequency | 357.14 MHz | — |
| Configuration | Passive Serial / Passive Parallel / JTAG / EPC device | SRAM-based, requires configuration device |
| Estado RoHS | Compliant (lead-free N suffix) | Compliant |
| Origin | Altera (acquired by Intel, 2015) | — |
| Series | — | Stratix I |
| Logic Elements | — | 25,660 |
| Logic Array Blocks (LABs) | — | 2,566 |
| Embedded Memory (bits) | — | 1,944,576 |
| Encapsulado | — | 672-BBGA / 672-FBGA (FineLine BGA) |
| Package Body Size | — | 35 mm x 35 mm |
| Ball Pitch | — | 1.27 mm |
| Supply Voltage (Core) | — | 1.5 V |
| Tipo de montaje | — | Surface Mount |
| Lead-Free | — | Yes |