EP1SGX25DF672C5N vs EP1SGX25DF672C6 Comparación
Comparación detallada lado a lado de EP1SGX25DF672C5N por Intel y EP1SGX25DF672C6 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP1SGX25DF672C5N | EP1SGX25DF672C6 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Obsolete | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $1.232,25 | $96,50 |
| Series | Stratix GX | Stratix GX |
| Logic Elements | 25,660 LE | 25,660 LE |
| User I/O Count | 455 | 455 |
| Total RAM Bits | 1,944,576 bits | 1,944,576 bits |
| Supply Voltage (Core) | 1.5 V (1.425 V to 1.575 V) | — |
| Transceiver Data Rate | Up to 3.1875 Gbps | — |
| Number of Transceivers | 20 | 6 channels (per Stratix GX family) |
| DSP Blocks | 10 (dedicated 18x18 multipliers) | — |
| Package Type | 672-ball Flip-Chip BGA (FBGA-672) | — |
| Package Dimensions | 27 mm x 27 mm, 1.0 mm pitch | 33 x 33 mm |
| Temperatura de funcionamiento | 0 C to 85 C (Commercial) | 0C to +85C (commercial) |
| Speed Grade | C5 | — |
| Process Technology | 130 nm CMOS | CMOS |
| Configuration Modes | PS, PPS, FPP, JTAG | — |
| Tipo de montaje | Surface Mount (FBGA) | Surface Mount |
| Lead Free / RoHS | Lead free per Altera/Intel datasheet | — |
| Number of LABs | — | 2,566 |
| Max Transceiver Data Rate | — | 3.125 Gbps |
| Core Voltage | — | 1.5 V |
| Encapsulado | — | 672-BBGA FineLine BGA |
| Ball Pitch | — | 1.0 mm |
| Lead-Free / RoHS | — | Lead-Free (per FBGA suffix family) |