EP1SGX25DF672C7 vs EP1SGX25DF672C7N Comparación
Comparación detallada lado a lado de EP1SGX25DF672C7 por Intel y EP1SGX25DF672C7N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Intel
EP1SGX25DF672C7N - Stratix GX FPGA 25K LE 672-BGA | Intel / Altera
EP1SGX25DF672C7N ⚠ Última compraComparación de especificaciones
| Parámetro | EP1SGX25DF672C7 | EP1SGX25DF672C7N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Obsolete | Última compra |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $125,40 | $245,00 |
| Series | Stratix GX | Stratix GX |
| Family | Stratix GX | — |
| Logic Elements (LE) | 25,660 | — |
| Logic Array Blocks (LABs) | 2,566 | — |
| Total RAM Bits | 1,944,576 | — |
| User I/O Count | 455 | — |
| Embedded DSP Blocks | 14 | — |
| Embedded Transceivers | Yes (GX family) | — |
| Process Technology | 0.13 µm CMOS, SRAM-based | 130 nm CMOS |
| Core Supply Voltage | 1.425 V to 1.575 V (1.5 V nominal) | 1.5 V |
| Temperatura de funcionamiento | 0 °C to +85 °C (Commercial) | 0 °C to 85 °C (Commercial) |
| Encapsulado | 672-FBGA (27 × 27 mm, 1.0 mm pitch) | 672-ball FineLine BGA (FBGA-672) |
| Tipo de montaje | Surface Mount | Surface Mount (BGA) |
| Lead Free / RoHS | Lead-Free, RoHS Compliant | — |
| Speed Grade | C7 (moderate Fmax bin) | C7 |
| PLL Count | [DATA_NEEDED: PLL count] | — |
| Logic Elements | — | 25,660 |
| Embedded Memory | — | 1,944,576 bits |
| Maximum User I/O | — | 455 |
| Number of Transceivers | — | 4 |
| Transceiver Data Rate (Max) | — | 3.125 Gbps |
| Package Dimensions | — | 33 × 33 mm, 1 mm pitch |
| Lead-Free / RoHS | — | Yes (lead-free, per datasheet) |
| Estado RoHS | — | Compliant |