EP1SGX25DF672C7N vs EP1SGX25DF672I5N Comparación
Comparación detallada lado a lado de EP1SGX25DF672C7N por Intel y EP1SGX25DF672I5N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Intel
EP1SGX25DF672C7N - Stratix GX FPGA 25K LE 672-BGA | Intel / Altera
EP1SGX25DF672C7N ⚠ Última compraIntel
EP1SGX25DF672I5N - Stratix GX FPGA, 25.6K LE, 3.1875Gbps SERDES
EP1SGX25DF672I5N ⚠ Última compraComparación de especificaciones
| Parámetro | EP1SGX25DF672C7N | EP1SGX25DF672I5N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Última compra | Última compra |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $245,00 | $118,00 |
| Series | Stratix GX | — |
| Logic Elements | 25,660 | 25,660 |
| Embedded Memory | 1,944,576 bits | [DATA_NEEDED: TriMatrix memory block count] |
| Maximum User I/O | 455 | — |
| Number of Transceivers | 4 | — |
| Transceiver Data Rate (Max) | 3.125 Gbps | — |
| Core Supply Voltage | 1.5 V | 1.5 V |
| Process Technology | 130 nm CMOS | 130 nm CMOS |
| Temperatura de funcionamiento | 0 °C to 85 °C (Commercial) | -40C to +85C (Industrial) |
| Encapsulado | 672-ball FineLine BGA (FBGA-672) | 672-ball FC-FBGA |
| Package Dimensions | 33 × 33 mm, 1 mm pitch | — |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount |
| Lead-Free / RoHS | Yes (lead-free, per datasheet) | — |
| Speed Grade | C7 | — |
| Estado RoHS | Compliant | Compliant |
| Family | — | Stratix GX |
| Logic Cells (CLBs) | — | 2,566 |
| High-Speed Transceiver Channels | — | 4 to 20 (CDR/SERDES) |
| Max Transceiver Data Rate | — | 3.1875 Gbps |
| Package Body Size | — | 33 x 33 mm |
| Ball Pitch | — | 1.0 mm |
| Lead-Free | — | Yes |
| Logic Family | — | CMOS (SRAM-based FPGA) |
| Total I/O Pins | — | [DATA_NEEDED: total user I/O pin count] |