EP1SGX40DF1020I6N vs EP1SGX40DF1020I6 Comparación
Comparación detallada lado a lado de EP1SGX40DF1020I6N por Intel y EP1SGX40DF1020I6 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP1SGX40DF1020I6N | EP1SGX40DF1020I6 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $1.450,00 | $198,00 |
| Series | Stratix GX | — |
| Family | Stratix (First Generation) | Stratix GX |
| Manufacturer | Intel (formerly Altera) | — |
| Core Supply Voltage | 1.425 V to 1.575 V (1.5 V nominal) | — |
| Number of Logic Elements (LEs) | 41,250 | — |
| Number of LABs (Logic Array Blocks) | 4,125 | — |
| Total RAM Bits | 3,423,744 | — |
| Maximum User I/O Pins | 624 | — |
| Number of I/O Banks | [DATA_NEEDED: I/O bank count] | — |
| High-Speed Transceivers | Integrated GX SerDes (channels, data rate: [DATA_NEEDED: per Stratix GX handbook]) | — |
| Embedded DSP Blocks | Yes (DSP block count: [DATA_NEEDED: per device datasheet]) | — |
| Encapsulado / Carcasa | 1020-BBGA / 1020-FBGA | — |
| Package Size | 33 x 33 mm, 1.0 mm pitch | — |
| Supplier Device Package | 1020-FBGA (33 x 33) | — |
| Temperatura de funcionamiento | 0 C to 85 C (industrial grade 'I') | — |
| Speed Grade | 6 (I6) | — |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount |
| Nivel MSL | [DATA_NEEDED: MSL rating] | [DATA_NEEDED: moisture sensitivity level] |
| Estado RoHS | [DATA_NEEDED: confirm RoHS on datasheet] | [DATA_NEEDED: RoHS compliance status] |
| Logic Family | CMOS (SRAM-based configuration) | — |
| Packaging | Tray / Bulk | — |
| Configuration Mode | Passive Serial / Fast Passive Parallel / JTAG (per Stratix GX handbook) | — |
| Logic Elements | — | 41,250 |
| Configurable Logic Blocks (CLBs) | — | 4,125 |
| Embedded Memory Bits | — | 3,423,744 |
| Maximum User I/Os | — | 624 |
| Combinatorial Delay (CLB max) | — | 8.245 ns |
| Core Voltage | — | 1.5 V |
| Process Technology | — | 130 nm CMOS |
| Maximum Operating Frequency | — | [DATA_NEEDED: actual frequency in MHz] |
| Encapsulado | — | 1020-ball FC-FBGA |
| Package Code | — | BGA |
| Ball Pitch | — | 1.00 mm |
| Operating Temperature Grade | — | Industrial (I6) |