EP20K100CF324C7ES vs EP20K100CF324C9 Comparación
Comparación detallada lado a lado de EP20K100CF324C7ES por Intel y EP20K100CF324C9 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP20K100CF324C7ES | EP20K100CF324C9 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Obsolete | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $52,75 | $71,00 |
| Family | APEX-20K | APEX 20K |
| Logic Elements / Cells | 4160 | — |
| Total System Gates | 263000 | — |
| Number of I/O | 246 | — |
| Number of LABs/CLBs | [DATA_NEEDED: LAB count] | — |
| Number of Logic Elements/Cells | 4160 | — |
| Total RAM Bits | 53248 | — |
| Number of Embedded System Blocks (ESBs) | 16 | — |
| Number of PLLs | 4 | — |
| Voltage - Supply | 2.375 V to 2.625 V | — |
| Temperatura de funcionamiento | 0C to +85C | 0C to +85C (Commercial) |
| Speed Grade | C7 | -9 (C9) |
| Tipo de montaje | Surface Mount | Surface Mount |
| Encapsulado / Carcasa | 324-FBGA (19x19 mm) | — |
| Supplier Device Package | 324-FBGA (19x19) | — |
| Process Technology | 0.22 micrometer CMOS | — |
| Estado RoHS | unknown | [DATA_NEEDED: RoHS status] |
| Series | — | APEX II |
| Logic Elements | — | 4160 |
| Typical Gates | — | 100000 |
| Maximum User I/O | — | 246 |
| Encapsulado | — | 324-FBGA (FineLine BGA) |
| Core Voltage | — | 1.8 V (typical, APEX II) |
| I/O Voltage Support | — | 2.5 V / 3.3 V |
| Configuration Interface | — | JTAG (IEEE 1149.1) / Passive serial |
| Embedded System Blocks | — | Yes (ESB for RAM/ROM/CAM) |
| Lead Free | — | [DATA_NEEDED: lead-free status] |