EP20K160EFC484-3 vs EP20K200EFC484-2X Comparación
Comparación detallada lado a lado de EP20K160EFC484-3 por Intel y EP20K200EFC484-2X por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Intel
EP20K160EFC484-3 - 160K Gates APEX-20KE FPGA 316 I/O 484-FBGA | Intel
EP20K160EFC484-3 ⚠ Última compraComparación de especificaciones
| Parámetro | EP20K160EFC484-3 | EP20K200EFC484-2X |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Última compra | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $26,80 | $54,40 |
| Series | APEX-20KE | — |
| Family | APEX-20KE MultiCore FPGA | APEX-20KE |
| Number of Logic Elements | 6,400 | — |
| Number of System Gates | 160,000 | — |
| Total RAM Bits | 81,920 | 106,496 |
| Number of I/O | 316 | — |
| Number of Logic Array Blocks (LABs) | [DATA_NEEDED: number of LABs] | — |
| Number of Embedded System Blocks (ESBs) | [DATA_NEEDED: number of ESBs] | — |
| Process Technology | 0.22 µm CMOS | 0.22 µm CMOS |
| Core Supply Voltage | 1.8 V | — |
| Internal Frequency (max) | 323 MHz | — |
| Propagation Delay | 1.55 ns | 2.5 ns |
| Encapsulado | 484-BBGA (Fine-pitch BGA) | 484-FBGA (23x23 mm) |
| Tipo de montaje | Surface Mount | — |
| Temperatura de funcionamiento | 0°C to +85°C | 0 °C to 85 °C |
| Estado RoHS | compliant | [DATA_NEEDED: RoHS compliance] |
| Tensión de alimentación | 1.71 V to 1.89 V | — |
| Logic Elements | — | 8,320 |
| LABs/CLBs | — | 832 |
| Gate Count | — | 200,000 |
| User I/O Pins | — | 376 |
| Max Operating Frequency | — | 205 MHz |
| Core Supply Voltage (VCCINT) | — | 1.71 V to 1.89 V (1.8 V nominal) |
| I/O Supply Voltage (VCCIO) | — | 3.3 V / 2.5 V (multi-standard) |
| Package Code | — | BGA, Ball, Square |
| Speed Grade | — | -2X |