EP20K300EFC672-2 vs EP20K300EFC672-2X Comparación
Comparación detallada lado a lado de EP20K300EFC672-2 por Intel y EP20K300EFC672-2X por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP20K300EFC672-2 | EP20K300EFC672-2X |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Obsolete | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $58,50 | $99,50 |
| Family | APEX 20KE | APEX 20KE |
| Series | APEX 20K | — |
| System Gates | 300,000 | 300,000 |
| Logic Elements | 11,520 | 11,520 |
| Embedded Memory (ESB) | 147,456 bits | — |
| Maximum User I/O | 408 | 408 |
| Maximum Internal Frequency | 350 MHz | 350 MHz |
| Propagation Delay (pin-to-pin) | 1.68 ns | — |
| Logic Family | CMOS | — |
| Core Process Technology | 0.22 µm | — |
| Core Supply Voltage | 1.8 V | 1.8 V |
| Encapsulado | 672-pin FineLine BGA (FBGA) | 672-pin FBGA (Fine-pitch BGA) |
| Temperatura de funcionamiento | 0 °C to 85 °C (commercial) | 0 °C to +85 °C (Commercial) |
| Configuration Interface | Passive Serial / EPC / JTAG (IEEE 1149.1) | — |
| Programming Tool | Quartus II / MAX+PLUS II | — |
| Tipo de montaje | Surface Mount (BGA) | — |
| Embedded Memory Bits | — | 147,456 bits |
| Process Technology | — | 0.22 µm CMOS |
| Propagation Delay | — | 1.68 ns |
| Speed Grade | — | -2 |
| PLLs | — | 4 |
| Architecture | — | MultiCore (LUT + Embedded System Blocks) |
| JTAG Support | — | Yes (IEEE 1149.1) |