EP20K30EFC144-1N vs EP20K160ETC144-2N Comparación
Comparación detallada lado a lado de EP20K30EFC144-1N por Intel y EP20K160ETC144-2N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP20K30EFC144-1N | EP20K160ETC144-2N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Obsolete | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $125,00 | $82,00 |
| Series | APEX-20KE | APEX-20KE |
| Device Family | APEX-20K MultiCore (LUT + Product-Term + ESB) | — |
| Gates | 30,000 | — |
| Logic Elements | 1,200 | — |
| Embedded SRAM Bits | 24,576 | — |
| User I/Os | 93 (per Mouser/Kynix listing); 408 (per alternate datasheet listing - see note) | 88 |
| Package Type | 144-pin FineLine BGA (FBGA) | — |
| Internal Frequency (max) | 160 MHz | 160 MHz |
| Propagation Delay | 1.68 ns | 1.55 ns |
| Logic Family | CMOS | — |
| Core Technology | 0.22 µm CMOS, SRAM-based configuration | — |
| Supply Voltage (Core) | 1.71 V to 1.89 V (1.8 V nominal) | — |
| Temperatura de funcionamiento | 0 °C to 85 °C (commercial, N suffix) | 0 C to 85 C |
| Configuration Interface | IEEE 1149.1 JTAG + serial configuration (external EPCx required) | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Estado RoHS | Unknown - not stated in verified sources | — |
| Family | — | APEX 20KE |
| Logic Elements / Cells | — | 6400 |
| Macros / Logic Elements (LE) | — | 640 |
| System Gates | — | 160,000 |
| On-Chip RAM Bits | — | 81920 |
| Number of I/O Banks | — | 8 |
| Core Voltage | — | 1.8 V (1.71 V to 1.89 V) |
| Technology Node | — | 0.22 um CMOS |
| Encapsulado / Carcasa | — | 144-LQFP (20x20 mm) |
| Supplier Device Package | — | 144-TQFP |
| Configuration Mode | — | JTAG, Passive Serial |
| Lead-Free / RoHS | — | [DATA_NEEDED: lead-free status] |