EP20K400BI652-2V vs EP20K400BC652-3 Comparación
Comparación detallada lado a lado de EP20K400BI652-2V por Intel y EP20K400BC652-3 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Intel
EP20K400BI652-2V - 400K Gates APEX 20K FPGA 652-BGA | Intel / Altera
EP20K400BI652-2V Obsolete
Comparación de especificaciones
| Parámetro | EP20K400BI652-2V | EP20K400BC652-3 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Obsolete | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $84,50 | $189,00 |
| Family | APEX 20K | APEX 20K |
| Series | APEX 20K (EPLD-based SOPC) | — |
| System Gates | 400,000 | — |
| Logic Elements | 16,640 | 16,640 |
| Maximum User I/O | 502 | — |
| Embedded Memory (bits) | 212,992 | 212,992 |
| Embedded Memory Blocks | ESBs (Embedded System Blocks) | — |
| Macros (per Mouser listing) | 1664 | — |
| Logic Family | CMOS | — |
| Process Technology | 0.22 μm | CMOS |
| Core Supply Voltage (VCCINT) | 2.5 V | — |
| Propagation Delay | 2.5 ns (typical) | 3.6 ns |
| Internal Performance | 200 MHz (speed grade -2) | — |
| Temperatura de funcionamiento | 0 °C to +85 °C (industrial, "I") | 0 C to +85 C |
| Encapsulado | 652-ball FineLine BGA (35 × 35 mm, 1.27 mm pitch) | BGA-652 (BC652) |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount |
| Estado RoHS | [DATA_NEEDED: rohs_status] | [DATA_NEEDED: RoHS status] |
| Configuration Interface | JTAG (IEEE 1149.1) / Passive Serial | JTAG (IEEE 1149.1), ByteBlaster |
| Macro Cells | — | 1,664 |
| Maximum User I/Os | — | 502 |
| Number of I/O Banks | — | 8 |
| Supply Voltage (Core) | — | 2.5 V |
| Speed Grade | — | -3 |
| Design Software | — | Quartus II (legacy) |
| Architecture | — | MultiCore (LUT + product-term + embedded memory) |