EP20K400CB652C9ES vs EP20K400BI652-2V Comparación
Comparación detallada lado a lado de EP20K400CB652C9ES por Intel y EP20K400BI652-2V por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Intel
EP20K400BI652-2V - 400K Gates APEX 20K FPGA 652-BGA | Intel / Altera
EP20K400BI652-2V ObsoleteComparación de especificaciones
| Parámetro | EP20K400CB652C9ES | EP20K400BI652-2V |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $195,00 | $84,50 |
| Series | APEX 20KC | APEX 20K (EPLD-based SOPC) |
| Family | APEX 20KC | APEX 20K |
| Logic Elements / Cells | 16640 | — |
| Total System Gates | 400000 | — |
| Embedded Memory (Bits) | 212992 | — |
| Number of User I/O | 488 | — |
| Number of LABs/CLBs | [DATA_NEEDED: LAB count] | — |
| Number of Logic Array Blocks | 1040 | — |
| Maximum Operating Frequency | 250 MHz | — |
| Core Voltage | 1.8 V | — |
| Process Technology | 0.15 µm CMOS | 0.22 μm |
| Rango de temperatura de funcionamiento | 0°C to +85°C (Commercial) | — |
| Tipo de montaje | Surface Mount | Surface Mount (BGA) |
| Encapsulado / Carcasa | 652-BGA | — |
| Nivel MSL | 3 (168 Hours) | — |
| Packaging | Tray | — |
| Programmability Type | In-system programmable (SRAM-based) | — |
| I/O Standards Supported | LVTTL, LVCMOS, PCI, LVDS, HSTL, SSTL | — |
| JTAG (IEEE 1149.1) | Yes | — |
| PLL | Yes (4-phase) | — |
| Estado RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: rohs_status] |
| System Gates | — | 400,000 |
| Logic Elements | — | 16,640 |
| Maximum User I/O | — | 502 |
| Embedded Memory (bits) | — | 212,992 |
| Embedded Memory Blocks | — | ESBs (Embedded System Blocks) |
| Macros (per Mouser listing) | — | 1664 |
| Logic Family | — | CMOS |
| Core Supply Voltage (VCCINT) | — | 2.5 V |
| Propagation Delay | — | 2.5 ns (typical) |
| Internal Performance | — | 200 MHz (speed grade -2) |
| Temperatura de funcionamiento | — | 0 °C to +85 °C (industrial, "I") |
| Encapsulado | — | 652-ball FineLine BGA (35 × 35 mm, 1.27 mm pitch) |
| Configuration Interface | — | JTAG (IEEE 1149.1) / Passive Serial |