EP20K400EFI672-2X vs EP20K400FC672-2 Comparación
Comparación detallada lado a lado de EP20K400EFI672-2X por Intel y EP20K400FC672-2 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP20K400EFI672-2X | EP20K400FC672-2 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $168,00 | $171,00 |
| Family | APEX 20KE | APEX-20K (MultiCore) |
| Series | EP20K400E | APEX-20K |
| Logic Elements | 16,640 | — |
| System Gates | 400,000 | — |
| Embedded Memory | 212,992 bits | — |
| Maximum User I/O | 488 | 502 |
| Number of I/O Banks | 8 | [DATA_NEEDED: I/O bank count] |
| PLLs | 4 | — |
| Core Voltage (VCCINT) | 1.71 V to 1.89 V (1.8 V nominal) | — |
| Process Technology | 0.22 µm CMOS | 0.22 µm CMOS |
| Maximum Internal Frequency | 223 MHz | — |
| Temperatura de funcionamiento | 0 °C to 85 °C (Industrial) | 0°C to +85°C (Commercial) |
| Encapsulado | 672-ball FineLine BGA (FC-FBGA), 27 × 27 mm | 672-ball FC-FBGA (BBGA) |
| Ball Pitch | 1.27 mm | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Nivel de sensibilidad a la humedad (MSL) | 3 | — |
| Peak Reflow Temperature | 220 °C | — |
| Sin halógenos | Compliant | — |
| Estado RoHS | Compliant | [DATA_NEEDED: RoHS status] |
| Logic Elements / Cells | — | 16640 |
| Number of Macrocells | — | 1664 |
| Number of Logic Blocks | — | [DATA_NEEDED: LAB count] |
| Number of Gates | — | 400000 |
| Embedded Memory (Bits) | — | 212992 |
| Operating Frequency (Max) | — | 200 MHz |
| Propagation Delay (tpd) | — | 2.5 ns |
| Core Supply Voltage | — | 2.5 V |
| Speed Grade | — | -2 |