EP20K400FC672-2 vs EP20K400EFI672-2X Comparación
Comparación detallada lado a lado de EP20K400FC672-2 por Intel y EP20K400EFI672-2X por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP20K400FC672-2 | EP20K400EFI672-2X |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Obsolete | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $171,00 | $168,00 |
| Series | APEX-20K | EP20K400E |
| Family | APEX-20K (MultiCore) | APEX 20KE |
| Logic Elements / Cells | 16640 | — |
| Number of Macrocells | 1664 | — |
| Number of Logic Blocks | [DATA_NEEDED: LAB count] | — |
| Number of Gates | 400000 | — |
| Embedded Memory (Bits) | 212992 | — |
| Maximum User I/O | 502 | 488 |
| Number of I/O Banks | [DATA_NEEDED: I/O bank count] | 8 |
| Operating Frequency (Max) | 200 MHz | — |
| Propagation Delay (tpd) | 2.5 ns | — |
| Core Supply Voltage | 2.5 V | — |
| Process Technology | 0.22 µm CMOS | 0.22 µm CMOS |
| Temperatura de funcionamiento | 0°C to +85°C (Commercial) | 0 °C to 85 °C (Industrial) |
| Encapsulado | 672-ball FC-FBGA (BBGA) | 672-ball FineLine BGA (FC-FBGA), 27 × 27 mm |
| Tipo de montaje | Surface Mount | Surface Mount |
| Estado RoHS | [DATA_NEEDED: RoHS status] | Compliant |
| Speed Grade | -2 | — |
| Logic Elements | — | 16,640 |
| System Gates | — | 400,000 |
| Embedded Memory | — | 212,992 bits |
| PLLs | — | 4 |
| Core Voltage (VCCINT) | — | 1.71 V to 1.89 V (1.8 V nominal) |
| Maximum Internal Frequency | — | 223 MHz |
| Ball Pitch | — | 1.27 mm |
| Nivel de sensibilidad a la humedad (MSL) | — | 3 |
| Peak Reflow Temperature | — | 220 °C |
| Sin halógenos | — | Compliant |