EP20K400FC784-3 vs EP20K400FI784-2 Comparación
Comparación detallada lado a lado de EP20K400FC784-3 por Intel y EP20K400FI784-2 por Altera. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP20K400FC784-3 | EP20K400FI784-2 |
|---|---|---|
| Marca | Intel | Altera |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Obsolete | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $175,00 | $82,40 |
| Family | APEX 20K (MultiCore) | — |
| Typical Gates | 400,000 | 400,000 |
| Maximum System Gates | 1,052,000 | — |
| Logic Elements | 21,168 | — |
| Maximum RAM Bits | 212,992 | — |
| Embedded System Blocks (ESBs) | 100 | [DATA_NEEDED: ESB count] |
| PLLs | 4 | — |
| User I/O Pins | 488 | — |
| Encapsulado | 784-ball FineLine BGA (FC) | — |
| Speed Grade | -3 | -2 |
| Temperatura de funcionamiento | Commercial (0°C to +85°C) | — |
| I/O Standards | MultiVolt I/O: 1.8V, 2.5V, 3.3V, 5.0V | — |
| Core Voltage | [DATA_NEEDED: core voltage] | — |
| Process Technology | 0.18 µm CMOS | [DATA_NEEDED: process node] |
| Configuration Method | Serial or parallel, SRAM-based | — |
| Estado RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS compliance] |
| Nivel MSL | [DATA_NEEDED: MSL rating] | [DATA_NEEDED: MSL rating] |
| Lead-Free | [DATA_NEEDED: lead-free status] | [DATA_NEEDED: lead-free status] |
| Device Family | — | APEX 20K |
| Logic Elements (LEs) | — | [DATA_NEEDED: logic elements count] |
| Maximum User I/O Pins | — | [DATA_NEEDED: user I/O count] |
| Dedicated Inputs | — | 4 |
| Nominal Core Supply Voltage (VCCINT) | — | 2.5 V |
| VCCINT Range | — | 2.375 V to 2.625 V |
| Rango de temperatura de funcionamiento | — | -40 °C to +100 °C |
| Package Type | — | S-PBGA-B784 (FineLine BGA) |
| Package Pin Count | — | 784 balls |
| Ball Pitch | — | 1.000 mm |
| Tipo de montaje | — | Surface Mount |
| Device Form Factor | — | Loadable PLD |
| Configuration Memory | — | SRAM-based (volatile) |