EP20K600CB672C8N vs EP20K600CF672 Comparación

Comparación detallada lado a lado de EP20K600CB672C8N por Intel y EP20K600CF672 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.

Intel
EP20K600CF672 EP20K600CF672 - 600K APEX 20KC FPGA, 672-BGA | Intel

EP20K600CF672 - 600K APEX 20KC FPGA, 672-BGA | Intel

EP20K600CF672 [data_needed: lifecycle status]

Comparación de especificaciones

Parámetro EP20K600CB672C8N EP20K600CF672
Marca Intel Intel
Categoría FPGA & CPLD FPGA & CPLD
Estado del ciclo de vida Obsolete [DATA NEEDED: Lifecycle Status]
Estado del stock In Stock In Stock
Precio unitario (USD) $69,00 $0,00
Family APEX-20KC —
Logic Elements (LEs) 24,320 —
Embedded Memory Bits 311,296 —
Maximum User I/O 508 —
Encapsulado 672-BBGA (FineLine BGA) —
Configuration Memory SRAM, in-system programmable [DATA_NEEDED: configuration memory type and capacity]
Configuration Schemes Passive Serial / Active Serial / JTAG (IEEE 1149.1) —
Core Voltage (VCCINT) 2.5 V —
I/O Voltage (VCCIO) 1.8 V / 2.5 V / 3.3 V (MultiVolt) —
Process Technology 0.18 µm CMOS 0.15 um all-layer copper-metal process for supplied family references
Temperatura de funcionamiento Commercial (0C to +85C) 0 C to 85 C for supplied EP20K600CF672C9N/C8N references
Speed Grade C8 —
PCI Support PCI-SIG compliant 3.3 V, 33/66 MHz, 32/64-bit —
External Memory Interface DDR SDRAM, ZBT SRAM —
Dedicated Clock Inputs 16 —
PLLs On-chip with clock-doubling and phase-shift —
LVDS Channels Up to 32 —
Estado RoHS [DATA_NEEDED: RoHS status] unknown
Tipo de montaje Surface Mount (BGA) Surface Mount
Product Type — Field-Programmable Gate Array (FPGA)
Product Family — APEX-20KC
Manufacturer — Altera / Intel
User I/O Lines — 508 I/O
Logic Elements — [DATA_NEEDED: logic element count]
Propagation Delay — 1.48 ns for supplied EP20K600CF672C9N/C8N references
Device Type Listed by Supplied References — SPLD
Performance Claim — Up to 35% faster than APEX 20KE devices
Package Type — 672-ball BGA, FCBGA
Package Dimensions — 45 mm x 45 mm
Ball Pitch — 1.27 mm
Configuration Device Type — Enhanced Configuration (EPC) device
Core Voltage — [DATA_NEEDED: core supply voltage]
I/O Voltage — [DATA_NEEDED: I/O supply voltage]
Embedded Memory — [DATA_NEEDED: embedded memory capacity]
REACH Status — unknown
AEC-Q100 Status — unknown

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