EP20K600CF672-3 vs EP20K600CF672 Comparación
Comparación detallada lado a lado de EP20K600CF672-3 por Intel y EP20K600CF672 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Intel
EP20K600CF672 - 600K APEX 20KC FPGA, 672-BGA | Intel
EP20K600CF672 [data_needed: lifecycle status]Comparación de especificaciones
| Parámetro | EP20K600CF672-3 | EP20K600CF672 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Obsolete | [DATA NEEDED: Lifecycle Status] |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $99,50 | $0,00 |
| Family | APEX 20KC | — |
| Typical Gates | 600,000 | — |
| Maximum System Gates | 2,432,000 | — |
| Maximum Logic Elements | 2,432 | — |
| Embedded System Memory | 311,040 bits (380 Kbits ESB) | — |
| User I/O Pins | 488 | — |
| Encapsulado | 672-ball FineLine BGA | — |
| Speed Grade | -3 | — |
| Process Technology | 0.18 µm CMOS | 0.15 um all-layer copper-metal process for supplied family references |
| PLLs | 4 | — |
| Maximum Internal Frequency | 180 MHz (per APEX 20K family datasheet) | — |
| Configuration Modes | PS, PPS, PPA, JTAG, EPC2/EPC16 | — |
| I/O Standards Supported | LVTTL, LVCMOS, SSTL-2/3, HSTL, LVDS, PCI | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Temperatura de funcionamiento | [DATA_NEEDED: operating temperature range] | 0 C to 85 C for supplied EP20K600CF672C9N/C8N references |
| Estado RoHS | Lead-free / RoHS compliant (per Alibaba listing) | unknown |
| Product Type | — | Field-Programmable Gate Array (FPGA) |
| Product Family | — | APEX-20KC |
| Manufacturer | — | Altera / Intel |
| User I/O Lines | — | 508 I/O |
| Logic Elements | — | [DATA_NEEDED: logic element count] |
| Propagation Delay | — | 1.48 ns for supplied EP20K600CF672C9N/C8N references |
| Device Type Listed by Supplied References | — | SPLD |
| Performance Claim | — | Up to 35% faster than APEX 20KE devices |
| Package Type | — | 672-ball BGA, FCBGA |
| Package Dimensions | — | 45 mm x 45 mm |
| Ball Pitch | — | 1.27 mm |
| Configuration Device Type | — | Enhanced Configuration (EPC) device |
| Core Voltage | — | [DATA_NEEDED: core supply voltage] |
| I/O Voltage | — | [DATA_NEEDED: I/O supply voltage] |
| Configuration Memory | — | [DATA_NEEDED: configuration memory type and capacity] |
| Embedded Memory | — | [DATA_NEEDED: embedded memory capacity] |
| REACH Status | — | unknown |
| AEC-Q100 Status | — | unknown |