EP20K600CF672-3X vs EP20K600CF672 Comparación
Comparación detallada lado a lado de EP20K600CF672-3X por Intel y EP20K600CF672 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Intel
EP20K600CF672-3X - 600K Gate APEX 20KC FPGA, F672, -3X Speed | Intel / Altera
EP20K600CF672-3X ObsoleteIntel
EP20K600CF672 - 600K APEX 20KC FPGA, 672-BGA | Intel
EP20K600CF672 [data_needed: lifecycle status]Comparación de especificaciones
| Parámetro | EP20K600CF672-3X | EP20K600CF672 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Obsolete | [DATA NEEDED: Lifecycle Status] |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $98,00 | $0,00 |
| Series | APEX 20KC | — |
| Family | APEX 20K (MultiCore) | — |
| Typical Gates | 600,000 | — |
| Logic Elements | 24,480 | [DATA_NEEDED: logic element count] |
| Maximum System Gates | 1,537,000 | — |
| Embedded System Blocks (ESBs) | 312 | — |
| Maximum RAM Bits | 311,296 | — |
| Maximum User I/O Pins | 508 | — |
| PLLs | 4 | — |
| Encapsulado | 672-pin FineLine BGA (F672) | — |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount |
| Speed Grade | -3X (fastest) | — |
| Temperatura de funcionamiento | 0C to +85C (commercial) | 0 C to 85 C for supplied EP20K600CF672C9N/C8N references |
| Process Technology | 0.18 um CMOS, SRAM-based | 0.15 um all-layer copper-metal process for supplied family references |
| Configuration Method | SRAM, serial/parallel, EPC support | — |
| Estado RoHS | [DATA_NEEDED: rohs status] | unknown |
| Nivel MSL | [DATA_NEEDED: MSL level] | — |
| Product Type | — | Field-Programmable Gate Array (FPGA) |
| Product Family | — | APEX-20KC |
| Manufacturer | — | Altera / Intel |
| User I/O Lines | — | 508 I/O |
| Propagation Delay | — | 1.48 ns for supplied EP20K600CF672C9N/C8N references |
| Device Type Listed by Supplied References | — | SPLD |
| Performance Claim | — | Up to 35% faster than APEX 20KE devices |
| Package Type | — | 672-ball BGA, FCBGA |
| Package Dimensions | — | 45 mm x 45 mm |
| Ball Pitch | — | 1.27 mm |
| Configuration Device Type | — | Enhanced Configuration (EPC) device |
| Core Voltage | — | [DATA_NEEDED: core supply voltage] |
| I/O Voltage | — | [DATA_NEEDED: I/O supply voltage] |
| Configuration Memory | — | [DATA_NEEDED: configuration memory type and capacity] |
| Embedded Memory | — | [DATA_NEEDED: embedded memory capacity] |
| REACH Status | — | unknown |
| AEC-Q100 Status | — | unknown |