EP20K600EFC672-1XN vs EP20K600EFC672-2X Comparación
Comparación detallada lado a lado de EP20K600EFC672-1XN por Intel y EP20K600EFC672-2X por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP20K600EFC672-1XN | EP20K600EFC672-2X |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Obsolete | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $285,00 | $115,00 |
| Family | APEX 20K (APEX-20KE) | APEX 20KE |
| System Gates | 1,560,000 (typical 600K) | — |
| Logic Elements | 24,320 | — |
| Typical Logic Elements | 311,296 | — |
| Macros (Logic Array Blocks) | 2,432 | — |
| User I/O Pins | 508 | — |
| Total RAM Bits | [DATA_NEEDED: total RAM bits] | — |
| Encapsulado | 672-ball FineLine BGA (FBGA) | — |
| Ball Pitch | 1.0 mm | — |
| Process Technology | 0.18 micron CMOS | 0.15 µm all-layer copper CMOS |
| Supply Voltage (Core) | 1.8 V typical | — |
| Temperatura de funcionamiento | 0C to 85C (commercial) | 0 °C to +85 °C (commercial) |
| Speed Grade | -1 (fastest) | — |
| Configuration Method | Serial or parallel, JTAG | Serial / Parallel (Quartus-supported) |
| Tipo de montaje | Surface Mount (BGA) | — |
| Nivel MSL | [DATA_NEEDED: MSL level] | — |
| Estado RoHS | [DATA_NEEDED: RoHS status] | Not RoHS compliant (X suffix is SnPb); use -2N suffix for lead-free |
| Typical Gates | — | 600,000 |
| Logic Elements / Cells | — | 24,320 |
| Embedded Memory Bits | — | 311,296 |
| Maximum User I/O | — | 508 |
| Number of PLLs | — | 4 |
| Package Type | — | 672-pin FineLine BGA (FC-FBGA) |
| Package Size | — | 45 x 45 mm, 1.27 mm pitch |
| Core Voltage | — | 1.8 V |
| Propagation Delay (typical) | — | 1.48 ns |
| Maximum Internal Frequency | — | 200 MHz |
| Lead-Free Variant | — | EP20K600EFC672-2N |