EP20K60EFC144-2XN vs EP20K60ETC144-1X Comparación
Comparación detallada lado a lado de EP20K60EFC144-2XN por Altera y EP20K60ETC144-1X por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Altera
EP20K60EFC144-2XN - APEX-20KE FPGA 60K Gates 93 I/O 144-BGA | Intel/Altera
EP20K60EFC144-2XN NrndIntel
EP20K60ETC144-1X - 60K-Gate APEX-20KE FPGA, 144-LQFP | Intel/Altera
EP20K60ETC144-1X ⚠ Última compraComparación de especificaciones
| Parámetro | EP20K60EFC144-2XN | EP20K60ETC144-1X |
|---|---|---|
| Marca | Altera | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | Última compra |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $152,00 | $152,00 |
| Series | APEX-20KE | APEX-20KE |
| Family | APEX-20K (MultiCore Architecture) | — |
| Typical Gate Count | 60,000 gates | — |
| Logic Elements / Embedded Array Blocks | 2,560 | — |
| Embedded Memory (Bits) | 32,768 | — |
| Maximum User I/O | 93 | — |
| Number of I/O Banks | [DATA_NEEDED: number of I/O banks] | — |
| Core Supply Voltage (VCCINT) | 1.71 V to 1.89 V | — |
| I/O Supply Voltage (VCCIO) | [DATA_NEEDED: VCCIO range] | — |
| Package Type | 144-BGA (Fine-pitch Ball Grid Array) | — |
| Package Code (per MPN suffix) | FBGA / LBGA, 13x13 mm | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Operating Temperature (TJ) | 0 C to +85 C (commercial) | — |
| Speed Grade | -2 (per MPN suffix) | — |
| Configuration Method | JTAG (IEEE 1149.1), Passive Serial, Parallel | — |
| Estado RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Logic Family | CMOS, SRAM-based LUT | CMOS |
| Logic Elements / Cells | — | 2,560 |
| Total Gates | — | 60,000 |
| Total RAM Bits | — | 32,768 |
| Number of I/O | — | 92 |
| Number of Logic Elements/Cells | — | 2,560 |
| Core Voltage | — | 1.8 V (1.71 V to 1.89 V) |
| Propagation Delay | — | 1.72 ns |
| Internal Frequency (Max) | — | 160 MHz |
| Temperatura de funcionamiento | — | 0 C to +85 C |
| Process Technology | — | 0.22 um CMOS |
| Encapsulado / Carcasa | — | 144-LQFP |
| Supplier Device Package | — | 144-TQFP (20x20 mm) |
| Terminal Pitch | — | 0.5 mm |
| Lead Finish / Terminal Form | — | Gull Wing (LQFP) |
| Architecture | — | MultiCore (SOPC) |
| Nivel MSL | — | [DATA_NEEDED: MSL level] |