EP2A25F672C8N vs EP2A25F672C9 Comparación
Comparación detallada lado a lado de EP2A25F672C8N por Intel y EP2A25F672C9 por Altera. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2A25F672C8N | EP2A25F672C9 |
|---|---|---|
| Marca | Intel | Altera |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $205,00 | $700,00 |
| Family | APEX II | APEX II |
| Technology Node | 0.15 um all-layer copper process | — |
| System Gates | 900,000 | — |
| Logic Elements / Cells | 24,320 | — |
| Maximum Internal Frequency | 333 MHz | — |
| Propagation Delay | 1.69 ns | 1.69 ns |
| User I/Os | 492 | — |
| Encapsulado | 672-ball FC-FBGA (FineLine BGA) | 672-ball FCBGA (FineLine BGA) |
| Package Body Size | 27 x 27 mm | — |
| Ball Pitch | 1.0 mm | 1.0 mm |
| Core Supply Voltage | 1.5 V | — |
| Speed Grade | C8 | — |
| Temperatura de funcionamiento | 0 C to 85 C (commercial) | 0°C to 85°C (Commercial) |
| Multi-Gigabit Transceiver Rate | Up to 1 Gbps per channel | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Estado RoHS | Compliant | [DATA_NEEDED] |
| Lead-Free Suffix | N (lead-free, Pb-free finish) | — |
| Logic Elements (LE) | — | Approximately 25,000 |
| Macro Cells | — | 2432 |
| User I/O | — | 492 |
| Package Dimensions | — | 27 mm x 27 mm |
| Process Technology | — | 0.15 µm all-layer copper, up to 8 metal layers |
| Logic Family | — | CMOS |
| Tensión de alimentación | — | [DATA_NEEDED: core VCC voltage] |
| I/O Standards | — | LVTTL, LVCMOS, PCI, LVDS, HSTL, SSTL (multi-voltage 1.5/1.8/2.5/3.3 V) |
| Configuration | — | Passive Serial, Passive Parallel Synchronous, JTAG |
| Embedded Memory | — | ESBs for dual-port RAM, ROM, FIFO |