EP2A25F672I7 vs EP2A25F672I6 Comparación
Comparación detallada lado a lado de EP2A25F672I7 por Intel y EP2A25F672I6 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2A25F672I7 | EP2A25F672I6 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Obsolete | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $198,00 | $178,00 |
| Family | APEX II | APEX II |
| Logic Elements | 24,320 | — |
| Gate Count | 900,000 | — |
| Maximum Frequency | 500 MHz | — |
| Process Technology | 0.15 µm CMOS | 0.18 µm CMOS |
| Core Voltage | 1.5 V | 1.5 V |
| Encapsulado | 672-pin FC-FBGA | 672-ball FineLine BGA (FBGA-672) |
| Tipo de montaje | Surface Mount | Surface Mount (BGA) |
| Operating Temperature Grade | Industrial (-40C to +100C) | — |
| Speed Grade | 7 | 6 |
| Programmable I/O Standards | LVTTL, LVCMOS, PCI, LVDS | — |
| Embedded Memory | Yes (Embedded System Blocks) | Embedded System Blocks (ESB), dual-port RAM / CAM |
| Configuration Interface | JTAG | — |
| Estado RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS compliance status] |
| Lead-Free | [DATA_NEEDED: lead-free status] | [DATA_NEEDED: lead-free status] |
| Logic Elements (typical gates) | — | 25,000 |
| Fabric Architecture | — | SRAM-based LUT |
| Configuration Method | — | External SRAM configuration device (EPC series) |
| Temperature Grade | — | Industrial (-40 °C to +100 °C ambient) |
| DSP Blocks | — | MultiCore dedicated multipliers |
| Boundary Scan | — | JTAG (IEEE 1149.1) compliant |
| Clock Management | — | Dedicated PLL / clock tree circuitry |
| I/O Bank Count | — | [DATA_NEEDED: number of user I/O banks] |
| Nivel MSL | — | [DATA_NEEDED: moisture sensitivity level] |