EP2A25F672I9 vs EP2A25F672I7N Comparación
Comparación detallada lado a lado de EP2A25F672I9 por Intel y EP2A25F672I7N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2A25F672I9 | EP2A25F672I7N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Obsolete | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $135,00 | $175,00 |
| Family | APEX II | APEX II |
| Manufacturer | Intel (formerly Altera) | — |
| Logic Elements (LEs) | 24,320 | — |
| System Gates (typical) | 900,000 | — |
| Maximum Operating Frequency | 236 MHz | — |
| Process Technology | 0.15 µm CMOS | 0.15 µm CMOS |
| Core Voltage (VCCINT) | 1.5 V | — |
| Encapsulado | 672-pin FC-FBGA | 672-ball FC-FBGA |
| Recuento de pines | 672 | — |
| Temperature Grade | Industrial (-40 °C to +100 °C) | — |
| Speed Grade | 9 (fastest APEX II grade) | 7 |
| Embedded System Blocks (ESBs) | Yes (dual-port RAM/ROM) | — |
| Maximum User I/O | [DATA_NEEDED: max user I/O pin count] | — |
| Maximum Memory Bits | 422,400 bits | — |
| PLLs | 4 | — |
| Tipo de montaje | Surface Mount (flip-chip BGA) | Surface Mount (BGA) |
| Peak Reflow Temperature | 220 °C (per distributor listing) | — |
| Nivel de sensibilidad a la humedad (MSL) | 3 | — |
| Estado RoHS | Unknown (legacy 2000s part; verify lot certificate) | [DATA_NEEDED: RoHS status] |
| Logic Elements (Cells) | — | 24,320 |
| Typical Gate Count | — | 900,000 |
| Maximum Internal Frequency | — | 500 MHz |
| Core Supply Voltage | — | 1.5 V |
| Pin/Ball Count | — | 672 |
| Operating Temperature Grade | — | Industrial (I) |
| Configuration Interface | — | JTAG (IEEE 1149.1), Passive Serial, Fast Passive Parallel |
| Design Software | — | Quartus II |
| Estado del ciclo de vida | — | Not Recommended for New Designs (NRND) |