EP2A40B652C7 vs EP2A40B724C8 Comparación
Comparación detallada lado a lado de EP2A40B652C7 por Intel y EP2A40B724C8 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2A40B652C7 | EP2A40B724C8 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Última compra | Última compra |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $0,00 | $615,00 |
| Device Family | APEX II | — |
| Logic Elements | 40,000 LEs | — |
| Maximum User I/O Pins | 538 (per package, [DATA_NEEDED: exact count for BGA-652]) | — |
| Encapsulado | 652-ball FineLine BGA | — |
| Embedded Memory | [DATA_NEEDED: ESB RAM bits for EP2A40] | — |
| Number of PLLs | [DATA_NEEDED: PLL count for EP2A40] | — |
| Operating Temperature Grade | Commercial (C suffix) | — |
| Speed Grade | 7 | — |
| I/O Standards Supported | LVTTL, LVCMOS, PCI, GTL+, SSTL, LVDS, LVPECL | True-LVDS, LVPECL, PCML, HyperTransport (up to 1 Gbps) |
| Supply Voltage (Core) | 1.8 V nominal [DATA_NEEDED: exact tolerance] | — |
| Supply Voltage (I/O) | Multi-voltage I/O [DATA_NEEDED: VCCIO range] | — |
| Process Technology | [DATA_NEEDED: process node] | 0.15 µm CMOS, all-layer copper, up to 8 metal layers |
| Configuration Method | SRAM-based, supported via EPC configuration devices | — |
| Estado RoHS | Unknown | [DATA_NEEDED: RoHS status per datasheet] |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount |
| Nivel MSL | [DATA_NEEDED: MSL rating] | — |
| Family | — | APEX II |
| Device Logic Elements / Cells | — | 38400 |
| Total System Gates | — | ~1.5 M |
| Total RAM Bits | — | 655360 |
| Number of I/O | — | 540 |
| Number of Logic Gates | — | [DATA_NEEDED: exact gate count in cells vs system gates] |
| Core Supply Voltage | — | 1.5 V (1.425 V to 1.575 V) |
| Maximum Internal Frequency | — | 376 MHz |
| Encapsulado / Carcasa | — | 724-BBGA, FCBGA (35 x 35 mm) |
| Supplier Device Package | — | 724-BGA |
| Temperatura de funcionamiento | — | 0 °C to 85 °C (TJ) |
| Shipping Media | — | Tray |
| Nivel de sensibilidad a la humedad (MSL) | — | [DATA_NEEDED: MSL level per JEDEC J-STD-020] |