EP2A40B724C8ES vs EP2A40B724C8 Comparación
Comparación detallada lado a lado de EP2A40B724C8ES por Intel y EP2A40B724C8 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2A40B724C8ES | EP2A40B724C8 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Obsolete | Última compra |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $162,00 | $615,00 |
| Series | APEX II (EP2A) | — |
| Family | Field Programmable Gate Array (FPGA) | APEX II |
| Logic Elements / Cells | 38,400 | — |
| Number of Gates (typical) | 655,360 | — |
| Number of I/O | 540 | 540 |
| Encapsulado | 724-BBGA / FCBGA | — |
| Speed Grade | -8 (C8) | — |
| Temperatura de funcionamiento | [DATA_NEEDED: operating temperature range] | 0 °C to 85 °C (TJ) |
| Tipo de montaje | Surface Mount | Surface Mount |
| Nivel MSL | [DATA_NEEDED: MSL moisture sensitivity level] | — |
| Estado RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status per datasheet] |
| Tensión de alimentación | [DATA_NEEDED: VCCINT / VCCIO core and I/O voltages] | — |
| Process Node | [DATA_NEEDED: CMOS process technology] | — |
| Embedded Memory | Embedded System Blocks (ESB) | — |
| Programmable Logic Type | SRAM-based, in-system reconfigurable | — |
| Lead-Free Status | [DATA_NEEDED: lead-free status] | — |
| Architecture | MultiCore interconnect with LABs and ESBs | — |
| Device Logic Elements / Cells | — | 38400 |
| Total System Gates | — | ~1.5 M |
| Total RAM Bits | — | 655360 |
| Number of Logic Gates | — | [DATA_NEEDED: exact gate count in cells vs system gates] |
| Core Supply Voltage | — | 1.5 V (1.425 V to 1.575 V) |
| Maximum Internal Frequency | — | 376 MHz |
| Process Technology | — | 0.15 µm CMOS, all-layer copper, up to 8 metal layers |
| I/O Standards Supported | — | True-LVDS, LVPECL, PCML, HyperTransport (up to 1 Gbps) |
| Encapsulado / Carcasa | — | 724-BBGA, FCBGA (35 x 35 mm) |
| Supplier Device Package | — | 724-BGA |
| Shipping Media | — | Tray |
| Nivel de sensibilidad a la humedad (MSL) | — | [DATA_NEEDED: MSL level per JEDEC J-STD-020] |