EP2A40B724I9 vs EP2A40FB724C8 Comparación
Comparación detallada lado a lado de EP2A40B724I9 por Intel y EP2A40FB724C8 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2A40B724I9 | EP2A40FB724C8 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Obsolete | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $150,00 | $205,00 |
| Family | APEX II | APEX II |
| Series | EP2A40 | — |
| Logic Elements / Cells | 38,400 | — |
| System Gates | 1,500,000 | — |
| Embedded Memory (bits) | 655,360 | — |
| Process Technology | 0.15 µm CMOS | CMOS, SRAM-based |
| Core Voltage | 1.5 V | 1.425 V to 1.575 V |
| Encapsulado | 724-pin FCBGA (FineLine BGA) | 724-BGA (FCBGA), 35 mm x 35 mm |
| Temperatura de funcionamiento | -40 °C to +100 °C (industrial) | Commercial (0 C to +85 C) per suffix |
| Speed Grade | 9 (slower, robust timing margin) | -8 |
| Temperature Grade Suffix | I (industrial) | — |
| PLLs | Up to 4 | — |
| Maximum User I/O Pins | [DATA_NEEDED: exact I/O pin count for EP2A40B724 package] | — |
| Tipo de montaje | Surface Mount | Surface Mount (BGA) |
| Estado RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Lead-Free | [DATA_NEEDED: lead-free status] | — |
| Device Logic Elements | — | 38,400 |
| Typical Gates | — | 40,000 |
| Total RAM Bits | — | 655,360 |
| User I/O Pins | — | 540 |
| Architecture | — | MultiCore (LUT + Embedded System Blocks) |
| Embedded System Blocks | — | Configurable dual-port SRAM / CAM / FIFO |
| Configuration Mode | — | JTAG / Passive Serial / Passive Parallel |